研究目的
Investigating the chip to chip communication pertaining to ultra-low power-based very large integrated device using photonic integrated circuits (PIC).
研究成果
The research demonstrates a highly efficient (more than 99%) chip to chip communication system using a combination of photonics and electronics, suitable for optical VLSI applications. The system operates at low potentials (0.5 V to 1.0 V) and achieves minimal losses, making it a promising solution for future miniaturization technology.
研究不足
The study focuses on low potential signals (0.5 V to 1.0 V) and specific materials (gallium aluminium arsenide for the laser diode and silicon for the photodiode), which may limit its applicability to other voltage ranges or materials. The research also assumes ideal conditions for minimal losses, which may not be achievable in all practical scenarios.
1：Experimental Design and Method Selection:
The research combines electronics and photonics for chip to chip communication, focusing on low potential signals (0.5 V to 1.0 V). It involves the use of nanoscale light sources, one-dimensional waveguides, and photodetectors.
2：5 V to 0 V). It involves the use of nanoscale light sources, one-dimensional waveguides, and photodetectors.
Sample Selection and Data Sources:
2. Sample Selection and Data Sources: The study uses a combination of gallium aluminium arsenide based laser diode, metamaterial-based three-layer waveguide, and silicon-based avalanche photodiode.
3：List of Experimental Equipment and Materials:
Gallium aluminium arsenide laser diode, metamaterial-based waveguide, silicon avalanche photodiode.
4：Experimental Procedures and Operational Workflow:
The process involves converting electrical signals to optical signals using a laser diode, transporting these signals through a waveguide with minimal loss, and converting them back to electrical signals at the receiving end using a photodiode.
5：Data Analysis Methods:
The efficiency of the system is analyzed using numerical expressions for internal and external quantum efficiency, coupling efficiency between components, and losses such as absorption, diffraction, dispersion, reflection, and scattering.
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