研究目的
The present study experimentally and numerically investigated the recast behavior in laser ablation of 4H–SiC.
研究成果
The study concludes that recast layer with humps is formed during the ablation, consisting of SiC, Si, and SiO2, with microcracks and pore clusters observed. The recast height and width are influenced by the average laser power, laser scanning speed, and laser pulse frequency, with recoil pressure and surface tension playing dominant roles in the formation of recast humps.
研究不足
The study focuses on the recast behavior in laser ablation of 4H–SiC and does not explore other materials or ablation techniques. The experimental and numerical models may have simplifications that do not capture all aspects of the complex physical processes involved.
The experiments were conducted by a laser cutting machine. The 4H–SiC wafers (Si- faces) were grooved by the laser cutting machine. A Yb:Glass fiber laser (Manlight ML50-PL-R-TKS) with a wavelength of 1080 nm worked at the pulsed mode with a pulse duration of 150 ns at the full-width at half-maximum (FWHM) to provide a random-polarized Gaussian beam. The laser beam was focused by a converging lens with a focal length of 80 mm. The focused beam diameter was 25.39 μm. The 3D profiles of the machined microgrooves were measured by a 3D laser microscope (Keyence VK-X200). Scanning electron microscope (SEM) and energy-dispersive X-ray spectroscopy (EDS) were employed to study the porosity, microcracks and oxidation of the recast humps.
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