研究目的
To develop and optimize the design and fabrication technology of long-range dielectric-loaded surface plasmon-polariton waveguides (LR-DLSPPWs) for next-generation photonic interconnects, plasmonic nanocircuitry, quantum optics, and biosensors.
研究成果
The proposed design and fabrication process flow for Al2O3/Au(Ag)/Al2O3 plasmonic LR-DLSPP waveguides successfully addressed the challenges of low-damage reactive ion etching of multilayer stacks with ultrathin metal films. The optimized waveguides demonstrated a propagation length of 0.27 mm at 785 nm wavelength and negligible signal cross-talks between crossed waveguides. This technology opens new opportunities in photonic interconnects, plasmonic nanocircuitry, quantum optics, and biosensors.
研究不足
The study faced challenges in dry etching of multilayer dielectric-metal-dielectric stacks with ultrathin noble metal films, particularly with alumina's hardness and low etching speed. The process required aggressive chlorine-based etching gases, which could degrade ultrathin metal films. Additionally, achieving high aspect ratio nanostructures with standard electron resists was difficult due to low selectivity.
1：Experimental Design and Method Selection:
The study involved numerical optimization of various multilayer nanoplasmonic waveguides with silver and gold ultrathin films between two Al2O3 dielectric layers on a quartz substrate. The fabrication process included deposition of thin-film functional layers, e-beam lithography, and dry plasma-chemical etching.
2：Sample Selection and Data Sources:
Prime-grade quartz substrates were used. The samples were cleaned and prepared for thin-film deposition.
3：List of Experimental Equipment and Materials:
Equipment included a 10 kW e-beam evaporator, electron beam lithography (EBL) system, inductively coupled plasma-reactive ion etching (ICP-RIE) system, scanning electron microscope (SEM), and stylus profiler. Materials included 5N pure silver and gold pellets, 4N pure aluminum pellets, and silicon dioxide tablets.
4：Experimental Procedures and Operational Workflow:
The process began with substrate cleaning, followed by thin-film deposition, EBL patterning, and dry etching. The etching process was optimized to prevent damage to ultrathin metal films.
5：Data Analysis Methods:
The film thickness was measured by SEM cross-section and profilometry. Surface roughness and topography were analyzed using a stylus profiler and SEM.
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