研究目的
To design a transition between a hollow waveguide and a Substrate Integrated Waveguide (SIW) in a multi-layer substrate for low loss and wide bandwidth in the millimeter wave band.
研究成果
A transition from a hollow waveguide to SIW in a multi-layer substrate was designed with low loss and wide bandwidth. The reflection characteristics can be controlled by changing the dimensions of the back shorts and the windows on metal patterns of dielectric substrates.
研究不足
The study focuses on the design and simulation of the transition without physical prototype testing. The performance is evaluated based on electromagnetic simulation, which may differ from real-world conditions.
1：Experimental Design and Method Selection:
The study proposes back short and window structures for impedance matching in the transition from a hollow waveguide to SIWs in a multi-layer substrate. Electromagnetic simulation based on the finite element method was used to evaluate the transition's performance.
2：Sample Selection and Data Sources:
The SIW is composed of via-hole arrangement in the substrate, with router cutting chosen to form complete waveguides with planar metal narrow walls in the substrate.
3：List of Experimental Equipment and Materials:
Three-layer substrate (thickness: 1 mm; width: 1.6 mm; relative permittivity εr = 2.58; tanδ =
4：6 mm; relative permittivity εr = 58; tanδ = 0014), bonding film (thickness:
0.0014), bonding film (thickness: 50 μm; relative permittivity εr = 2.50; tanδ =
5：50; tanδ = 0025), and copper (thickness:
0.0025), and copper (thickness: 50 μm).
6：Experimental Procedures and Operational Workflow:
The dimensions of windows and back short lengths were optimized to achieve impedance matching and control reflection characteristics.
7：Data Analysis Methods:
Reflection characteristics were analyzed based on the dimensions of windows and back short lengths to achieve low reflection levels over wide bandwidths.
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