研究目的
Investigating the resulting characteristics of additive manufactured (AM) parts irradiated by laser sources with different technical features for surface modification and polishing.
研究成果
A significant reduction of the surface roughness Ra was accomplished by using 50 W average power and scan speeds in the range of 300 mm s-1. Continuous wave laser sources have the potential to remove particles attached to the part’s surface by ablation. Further studies will be developed to select shielding gases to reduce oxidation during the post-process and to analyze the influence on crack formation.
研究不足
The high surface temperatures achieved during the laser process can cause undesired modifications, such as oxidation. Cracks were observed in all cases when processing larger areas due to the number of repetitions, remelting of resolidified material, and higher average temperatures caused by laser scan overlaps.
1:Experimental Design and Method Selection:
The study used a solid-state laser radiation source operating in Q-switch or continuous wave (cw) mode for laser polishing. The laser beam was focused onto the sample surface by an objective lens and scanned over the sample surface via deflection mirrors.
2:Sample Selection and Data Sources:
The material investigated was 18Ni (300 grade) Maraging steel, manufactured with an EOS M270 SLM machine. The AM samples were solid bodies with dimensions of
3:5 x 5 x 0 cmList of Experimental Equipment and Materials:
A solid-state laser (SPECTRON Laser Systems SL300, Nd:YAG, wavelength λ=1064 nm), white light profilometer (MicroProf?, FRT, Germany).
4:Experimental Procedures and Operational Workflow:
Single-track experiments were performed to identify a suitable process regime. Parameters such as pulse duration, scan speed, repetition rate, and average laser power were varied. Subsequently, experiments were applied to larger areas (5 x 5 mm2) with defined pitch distances.
5:Data Analysis Methods:
Surface roughness and microstructure were analyzed using a white light profilometer and SEM images.
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