摘要： Bessel beams are perfect candidates for laser microprocessing of transparent materials due to generation of high aspect ratio micro voids [1], and ability to control micro crack formation enables to efficiently cut them [2, 3]. The crack propagation direction is controlled by inducing asymmetry to beam profile [3], and allows ultra-fast glass cutting over non-straight lines. The laser-matter interaction of various nondiffracting beams is heavily investigated and their utilisation for laser microprocessing is soon to be expected. Vector beams that are more exotic than scalar counterparts and can have additional beneficial properties for micro-manufacturing of materials. For instance, vector Bessel beam has a doughnut shaped intensity profile with complex spatial distribution of polarisation and can be de-composed to two transverse polarisation intensity components [4]. In this work, we examine generation of vector Bessel beams using an axicon and an s-plate (Workshop of photonics) – radial polarization converter [5]. The s-plate allows generation of azimuthally or radially polarized beams while axicon converts it to nondifftracting Bessel vector beam. The polariser was used to separate its orthogonal polarisation components (Fig. 1). The proposed approach to generate these beams is beneficial for high energy beam systems because s-plate withstands ultrashort (fs-ps) high power pulses. To investigate their applicability to transparent material micro-fabrication we performed microprocessing of a glass with vector Bessel beams and were able to induce high aspect ratio volume modifications and micro cracks in transparent materials. Vector Bessel beams produces cylinder shaped material modifications of glass (Fig 2 a)) while the use of single polarisation component generates two parallel needle like material modification (Fig. 2 b)). By elongating the pulse duration to few ps we have observed micro crack formation extending perpendicular to the beam propagation direction and to two intensity peaks. (Fig. 2 c)). The produced modifications are investigated to increase the laser microprocessing quality and speed.