研究目的
To present the fabrication procedure of a 1.2-μm thick silica diaphragm with high uniformity using MEMS technique for creating a highly sensitive fiber optic Fabry-Perot pressure sensor suitable for medical applications.
研究成果
The study successfully fabricated a 1.2-μm thick silica diaphragm with high uniformity using MEMS technology, leading to the development of a fiber optic Fabry-Perot pressure sensor with a sensitivity of 12.4 nm/kPa. This sensor, requiring no post-etching or polishing, is suitable for mass production and has potential applications in medical fields requiring miniature size and high sensitivity.
研究不足
The fabrication process involves complex steps like photolithography and etching, which may require fine-tuning for optimal results. The sensor's performance could be affected by residual stress, requiring additional steps like stress cycling or annealing for improvement.
1：Experimental Design and Method Selection:
The study utilized MEMS techniques including photolithography, wet etching, and ICP etching to fabricate a silica diaphragm.
2：Sample Selection and Data Sources:
A commercially available double-polished 300-μm silicon wafer with a
3：5-μm silica layer was used. List of Experimental Equipment and Materials:
Equipment includes a spin coater, photolithography mask, electron-beam coater, and ICP etching system. Materials include S1813 positive photoresist, Ti, Ni, Au layers, ETMAH, and SF
4：Experimental Procedures and Operational Workflow:
The process involved spin coating, photolithography, metal layer coating, lift-off, wet etching, and ICP etching to release the silica diaphragm.
5：Data Analysis Methods:
The sensor's pressure response was tested using an optical sensing analyzer (OSA) to record spectra and measure sensitivity.
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single-mode fiber
SMF-28
Corning
Optical fiber for sensor construction
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ceramic ferrule
CF128-10
Thorlabs
Support for diaphragm during bonding
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double-polished silicon wafer
300-μm with 1.5-μm silica layer
Ultrasil Cooperation
Base material for the silica diaphragm fabrication
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S1813 positive photoresist
MicroChem
Used in photolithography for patterning
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MF-319 solution
MicroChem
Developer for photoresist
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Ethyltrimethylammonium hydroxide (ETMAH)
Envure SE 3330
SACHEM
Wet etching agent for silicon
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ICP etching system
Dry etching for precise silicon removal
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multi-mode fiber
GI 105/125
YOFC
Used to create FP cavity on fiber tip
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optical sensing analyzer
Si720
Micron Optics
Records sensor's spectra for pressure response testing
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