研究目的
Investigating the high-speed, high-density, cost-effective Cu-filled through-glass via (Cu bridge) as a novel transmission channel for heterogeneous chip integration.
研究成果
The Cu bridge presents a promising approach for next-generation heterogeneous integration, offering low signal transmission loss, high thermal stability, and cost-effective manufacturing compared to traditional TSVs. The study demonstrates the potential of glass interposers embedded with Cu bridges for high-speed signal processing and increased signal I/O in 2.5D and 2.1D packaging configurations.
研究不足
The study focuses on the fabrication and initial testing of Cu bridges, with potential limitations in long-term reliability and scalability for mass production not fully explored.
1：Experimental Design and Method Selection:
The study presents a novel Cu-filled through-glass via (Cu bridge) as a transmission channel, comparing its performance with traditional TSVs. The methodology includes simulation of signal transmission loss and fabrication of Cu bridges using laser irradiation and sandblasting for via opening.
2：Sample Selection and Data Sources:
Glass substrates with embedded copper bridges produced using laser irradiation and sandblasting techniques are used. The selection criteria focus on the ability to meet the requirements for increased signal I/O and high-speed signal processing.
3：List of Experimental Equipment and Materials:
The fabrication process involves electroless Cu plating and sputtering for Cu-seed/barrier layers deposition, photoresist film formation, Cu electroplating, and chemical mechanical polishing (CMP).
4：Experimental Procedures and Operational Workflow:
The process includes via opening by laser irradiation or sandblasting, Cu-seed layer deposition, photoresist patterning, Cu electroplating, and CMP for Cu bridge fabrication.
5：Data Analysis Methods:
The study analyzes the electrical resistance variability, thermal stability, and signal transmission loss of the Cu bridges using simulation and experimental measurements.
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