研究目的
To study the impact of deposition power on film characteristics of WS2 for suitable application in solar cells.
研究成果
WS2 thin film deposited by RF magnetron sputtering by varying power were carefully studied. All the efforts are given to optimize the sputtering parameter for suitable photovoltaic applications. It is established that 50W~150W is the optimized deposition power for RF magnetron sputtering for WS2 thin film deposition.
研究不足
The study focuses on the impact of deposition power on WS2 film characteristics but does not explore other deposition parameters such as temperature, target-substrate distance, etc., which could also significantly affect film properties.
1:Experimental Design and Method Selection:
Physical Vapor Deposition (PVD) technique like RF magnetron sputtering was used to grow ultra-thin tungsten di sulfide (WS2) layers on top of soda lime glass substrates. Deposition power of radio frequency magnetron sputtering was varied (50W, 100 W, 150 W,200 W and 250 W).
2:Sample Selection and Data Sources:
Soda lime glass substrates of 7.5 cm × 2.5 cm × 0.2 cm were used for film deposition.
3:5 cm × 5 cm × 2 cm were used for film deposition.
List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: A 50 mm diameter WS2 (99.99%) sputtering target (Kurt. J. Lesker) was used as source material. BRUKER αXS-D8 Advance CuKα diffractometer, Carl Zeiss Merlin field emission scanning electron microscope (FESEM), Hall Effect measurement system, HMS ECOPIA
4:99%) sputtering target (Kurt. J. Lesker) was used as source material. BRUKER αXS-D8 Advance CuKα diffractometer, Carl Zeiss Merlin field emission scanning electron microscope (FESEM), Hall Effect measurement system, HMS ECOPIA Experimental Procedures and Operational Workflow:
3000.
4. Experimental Procedures and Operational Workflow: Substrates were pre-cleaned in ultrasonic bath by sequential cleaning process (mechanical scrubbing–acetone–methanol–deionized water) and dried with N2 gas flow. Initial purging of sputtering chamber and Pre-sputtering were carried out for 15 min with 50 W power to remove unwanted components from the chamber. Deposition chamber base pressure was brought down to 10?4 Pa by turbo-molecular pump and the working pressure during all the deposition run was maintained at 1.5 Pa by flowing 4 sccm of purified Ar (99.99%) as the working gas into the chamber.
5:5 Pa by flowing 4 sccm of purified Ar (99%) as the working gas into the chamber.
Data Analysis Methods:
5. Data Analysis Methods: XRD patterns were recorded in the 2? range from 10? to 80? with a step size of 0.05? using Cu Kα radiation wavelength, λ= 1.5408?A. The mean crystallite sizes (D) of the films was calculated using Scherrer formula. Atomic force microscopy (AFM) was used to study a variety of surface effects present in embossed structures. Opto-electrical properties such as carrier concentration, mobility, and resistivity were measured by Hall Effect measurement system.
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