研究目的
To develop a simple and effective continuous flow ‘top down’ process to control the length of sliced MWCNTs using a vortex fluidic device (VFD) coupled with a 1064 nm pulse laser, and to demonstrate the ability to vertically self-assemble short MWCNTs on a silicon substrate.
研究成果
The study successfully developed a simple and effective method for controlling the length of MWCNTs using a VFD and laser, with the ability to vertically align the sliced MWCNTs on silicon substrates. The process reduces side wall defects and does not require chemicals or auxiliary substances, offering a scalable and environmentally friendly approach to MWCNT processing.
研究不足
The study focuses on the slicing and vertical alignment of MWCNTs but does not explore the potential applications of these materials in depth. The scalability of the process, while mentioned, requires further investigation.
1:Experimental Design and Method Selection:
The study utilized a vortex fluidic device (VFD) coupled with a 1064 nm pulse laser for slicing MWCNTs under continuous flow conditions without chemicals or auxiliary substances.
2:Sample Selection and Data Sources:
MWCNTs were dispersed in DMF and processed in the VFD under various laser energies and operational parameters.
3:List of Experimental Equipment and Materials:
A Q-switched Nd:YAG laser (Spectra Physics GCR170), VFD, DMF solvent, and silicon wafers were used.
4:Experimental Procedures and Operational Workflow:
MWCNTs were dispersed in DMF, ultrasonicated, and then processed in the VFD under continuous flow with laser irradiation at different energies. The sliced MWCNTs were then vertically assembled on silicon substrates.
5:Data Analysis Methods:
AFM, HRTEM, Raman spectroscopy, and TGA were used to characterize the sliced MWCNTs.
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