研究目的
To achieve minimum reflection and maximum absorption in silicon solar cells by means of laser and plasma treatment.
研究成果
By combining surface treatment through laser structuring and plasma etching, it is possible to significantly reduce the reflectivity of polycrystalline silicon solar cells, thereby enhancing their efficiency. The study demonstrates that this combined approach can achieve reflectivity reductions to as low as 1.9% - 2.6% for slurry sliced wafers and 1.7% - 2.1% for diamond sawn wafers in the efficient wavelength area for generating electric current.
研究不足
The etching process is very sensitive to parameters such as wafer thickness and the space ratio between electrode and wafer. Achieving consistent surface treatment requires precise adjustment of these parameters.
1:Experimental Design and Method Selection:
The study involves structuring silicon solar cells using laser radiation and plasma etching methods to reduce reflection and enhance absorption.
2:Sample Selection and Data Sources:
Polycrystalline silicon wafers sliced by slurry paste and diamond wire were used.
3:List of Experimental Equipment and Materials:
Laser source 'HyperRapid50' by Coherent, 'PlamaPro80' machine by Oxford Instruments Plasma Technology, UV/VIS spectrometer 'Lambda1050' by PerkinElmer, scanning electron microscope LEO 1455EP by ZEISS.
4:Experimental Procedures and Operational Workflow:
Laser treatment was performed with different configurations, followed by plasma etching. The samples were then analyzed for reflectivity and surface qualities.
5:Data Analysis Methods:
Reflectivity was measured using UV/VIS spectroscopy, and surface qualities were analyzed using scanning electron microscopy.
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