研究目的
Developing a lapping and polishing process for KY(WO4)2 to realize integrated active optical devices.
研究成果
A lapping and polishing process was developed for KY(WO4)2, achieving a surface roughness of 0.88 nm and a radius of curvature of 26.0 meters after polishing. However, further work is needed to apply this process reliably to thin KY(WO4)2-on-glass samples for integrated optical devices.
研究不足
The process was successfully developed for thick KY(WO4)2 samples (>300 μm), but challenges remained in applying it to thin layers (<300 μm) due to defects and stress. Further optimization is needed to achieve defect-free thin layers with high planarity.
1：Experimental Design and Method Selection:
The study focused on developing a lapping and polishing process for KY(WO4)2 to achieve thin, defect-free layers on glass substrates for integrated optical devices. The process involved bonding crystal samples onto a glass substrate and thinning them down to the desired thickness.
2：Sample Selection and Data Sources:
KY(WO4)2 samples of 10 mm × 10 mm × 1 mm were used, optically polished on one side and low grade polished on the other.
3：List of Experimental Equipment and Materials:
Equipment included a PM5 precision lapping and polishing machine from Logitech, cast iron and polyurethane disks, and various lapping and polishing particles (Al2O3, CeO2, SiO2).
4：2). Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: The process involved coarse, medium, and fine lapping stages followed by polishing. The samples were mounted on an ultra-parallel plate and subjected to controlled lapping and polishing conditions.
5：Data Analysis Methods:
Surface roughness and curvature were measured using an atomic force microscope (AFM) and a profilometer.
独家科研数据包，助您复现前沿成果，加速创新突破
获取完整内容-
Atomic Force Microscope
Fast Scan
Bruker
Used to measure surface roughness of polished KY(WO4)2 samples.
-
Profilometer
Dektak 8
Veeco
Used to measure the curvature of polished KY(WO4)2 samples.
-
SiO2 suspension
OP-U
Struers
Used for polishing KY(WO4)2 samples.
-
PM5 precision lapping and polishing machine
PM5
Logitech
Used for lapping and polishing KY(WO4)2 samples to achieve thin, defect-free layers.
-
Cast Iron Disk
Used for lapping KY(WO4)2 samples.
-
Polyurethane Disk
1LPE1-0600
Logitech
Used for polishing KY(WO4)2 samples.
-
Al2O3 particles
Used as lapping particles for KY(WO4)2 samples.
-
CeO2 slurry
0CON-023
Logitech
Used for pre-polishing KY(WO4)2 samples.
-
登录查看剩余6件设备及参数对照表
查看全部
