研究目的
Investigating the package structure of high power white chip-on-board (COB) light-emitting diode (LED) combined with a polymeric wire-grid polarizer film (WGF) to optimize its temperature-dependent performance.
研究成果
The optimized package structure with a glass plate and modified phosphor resin layer significantly reduces thermal resistance and enhances luminous efficacy, making it feasible to implement polymeric secondary optics in polarized COB LEDs. The study demonstrates the potential for improving the performance and applicability of COB LED lighting devices.
研究不足
The study is limited by the thermal and optical properties of the packaging materials, which affect the performance and feasibility of implementing polymeric secondary optics in COB LED devices.
1：Experimental Design and Method Selection:
The study proposed four package structures for performance comparison and optimization, including conventional, remote phosphor, modified phosphor resin layer, and an optimized structure with a glass plate.
2：Sample Selection and Data Sources:
Commercial available blue COB LED modules were used, encapsulated with phosphor resin.
3：List of Experimental Equipment and Materials:
Includes blue COB LED modules, polymeric wire-grid polarizer film, AlN resin, yellow phosphor, silicone resin, thermal grease, and a heat sink.
4：Experimental Procedures and Operational Workflow:
The COB LEDs were encapsulated with different resin mixtures, cured, and their performance was tested under various input powers.
5：Data Analysis Methods:
The thermal resistance and luminous efficacy were measured and analyzed to determine the optimal package structure.
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blue COB LED modules
LITUP TITAN-D
Used as the light source in the study.
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YAG phosphor
NYAG4355-ES
Intematix
Used in the modified phosphor resin layer for wavelength conversion.
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AlN microparticles
AlN020BF
UNITETEK
Used to enhance the thermal conductivity of the phosphor resin layer.
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silicone resin
IV-50
Resource Electronics Co.
Used as the base material for the phosphor and AlN resin mixtures.
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thermal grease
CH-10
JELCON
Used to enhance the thermal coupling between the MCPCB and the heat sink.
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graphene powder
Gi-PW-F031
Gimprovia
Mixed with thermal grease to enhance its thermal conductivity.
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heat sink
Igloo FR120
Used for dissipating heat from the COB LED modules.
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wire-grid polarizer film
HTN
Asahi Kasei
Used to polarize the light emitted by the COB LED.
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