研究目的
Investigating the temperature profile and transient response of thermally tunable ridge waveguides with laterally supported suspension to assess their thermal properties for applications in photonic and electronic integration circuits.
研究成果
The study confirmed a uniform temperature distribution along the waveguide except near the edges and measured the transient thermal response times. The suspended ridge waveguide structure is applicable to reliable, low-power, and fast-response thermally tunable devices. The delay time in thermal transient response was identified as a critical parameter for device design.
研究不足
The temperature measurement may be affected by nonuniform optical reflection due to defects on the Au/Ti heater surface and the instability of the measurement system. The maximum heating power is limited to avoid fracture of the heater.
1：Experimental Design and Method Selection:
The thermoreflectance imaging method was used for temperature measurement due to its high accuracy. The method involves measuring the optical reflectivity of the device under test, which is temperature dependent.
2：Sample Selection and Data Sources:
Thermally tunable ridge waveguides with laterally supported suspension were fabricated using electron beam lithography (EBL) and inductively coupled plasma (ICP) etching, followed by deposition of SiO2 cladding-1 and Au/Ti heater layers.
3：List of Experimental Equipment and Materials:
The setup included a light emitting diode (LED), a charge-coupled device (CCD) camera, a polarization beam splitter (PBS), and a microscope. The device was heated by applying electric current to the Au/Ti heater.
4：Experimental Procedures and Operational Workflow:
The optical reflectivity of the sample surface was measured under different temperatures. The steady temperature distribution and thermal transient response were obtained by tuning the delay time between synchronized signals.
5：Data Analysis Methods:
The correlation between temperature and optical reflectivity was used to derive temperature variations. The thermoreflectance coefficient was calibrated using a thermocouple.
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LED
Used to measure the optical reflectivity of the device under test.
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CCD camera
Used to capture images for temperature measurement.
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Polarization beam splitter
Used in the optical system for temperature measurement.
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Microscope
Used to measure the optical reflectivity of the device under test.
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Pulse generator
Used to drive the LED in pulse mode.
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Objective lens
100×, NA 0.6
Used in the microscope for high magnification imaging.
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Position controller
Used to stabilize the position of the device during measurements.
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Thermocouple
Used to calibrate the thermoreflectance coefficient.
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Electron beam lithography system
Used for fabricating the ridge waveguide.
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Inductively coupled plasma etcher
Used for etching the ridge waveguide.
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Plasma enhanced chemical vapor deposition system
Used for depositing SiO2 cladding-1 layer.
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Electron beam evaporation system
Used for depositing Au/Ti heater layers.
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