研究目的
To present a novel waveguide packaging for sub-millimeter and terahertz-wave devices suitable for large chip-width MMICs without requiring any additional fabrication process.
研究成果
The WR3.4 WG packaging technique with on-chip E-plane probes provides large freedom in design area with no etching process in MMIC fabrication. The parasitic modes can be effectively absorbed with lossy and high-permittivity material, achieving 1 dB coupling loss per probe and 60 dB isolation in the 260–320 GHz band.
研究不足
The study is limited to the 260–320 GHz band and specific configurations of waveguide packaging.
1：Experimental Design and Method Selection:
The study involved full electromagnetic simulation to analyze wave modes in a rectangular waveguide with thin E-plane slits for inserting large-width MMICs.
2：Sample Selection and Data Sources:
A
3：1-mm-wide test IC in the 260–320 GHz band was used. List of Experimental Equipment and Materials:
The setup included a WR
4：4 WG package with single slit and p-type Si block as absorber. Experimental Procedures and Operational Workflow:
The study measured transition loss and inter-port isolation.
5：Data Analysis Methods:
The results were analyzed to estimate insertion loss per single dipole antenna and verify isolation performance.
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