研究目的
Investigating the thermo-mechanical degradation at the finger-solder interface in crystalline silicon photovoltaic modules under thermal fatigue conditions and the effect of variable solder geometrical parameters on this degradation.
研究成果
The finger-solder interface was identified as the most susceptible to thermo-mechanical degradation under thermal cycling conditions. Solder thickness was found to be a critical parameter for maintaining the thermo-mechanical reliability of fingers, with damage accumulation significantly reduced by increasing solder thickness. Over-soldering was shown to increase damage accumulation at the finger-solder interface, highlighting the need for precision in the soldering process to enhance PV module reliability.
研究不足
The study's limitations include the assumption of uniform solder layer spread around the busbar for simulation ease and the focus on specific solder geometrical parameters (thickness and width) without exploring all possible variations.
1：Experimental Design and Method Selection:
A three-dimensional finite element model (FEM) of a PV module was developed using COMSOL multi-physics software package to simulate the thermo-mechanical behavior under thermal cycling conditions.
2：Sample Selection and Data Sources:
The study focused on the solder layer interfaces within the PV module, particularly the finger-solder interface.
3：List of Experimental Equipment and Materials:
The study utilized an environmental chamber (Weiss, WKS 3–1500/70/5) for thermal cycling tests, a module simulator (QuickSun-700) for I-V analysis, and an electroluminescence (EL) imaging setup with a silicon-CCD camera (Greateyes, GE BI MID) for defect mapping.
4：Experimental Procedures and Operational Workflow:
The PV modules were subjected to thermal cycling tests, followed by I-V and EL imaging analysis to assess degradation and identify finger breakages.
5：Data Analysis Methods:
Creep strain accumulation and principal stresses from FEM were used as damage metrics to analyze the thermo-mechanical degradation.
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