研究目的
Investigating the performance of a silicon-contacted Ge/Si avalanche photodiode for improving optical link margins in optical transceivers operating at 400 Gb/s and beyond.
研究成果
The presented waveguide-coupled Ge/Si SACM avalanche photodiode demonstrates high performance with a gain-bandwidth product of 300 GHz, making it a promising candidate for high-speed and high-sensitivity receivers in next-generation optical interconnects. The device's manufacturability and reproducibility are confirmed through wafer-scale measurements. Future work includes reducing dark current and further optimizing the device design for higher bandwidth.
研究不足
The device suffers from high dark current at high operating voltages, which could impact the final receiver sensitivity. The origin of such high leakage current is currently under investigation. Additionally, a detailed understanding of the impact of carrier transit time, avalanche buildup time, and electrical parasitics on the high-speed performance is needed for future design iterations.
1:Experimental Design and Method Selection:
The device is designed with a lateral SACM (Separate Absorption Charge Multiplication) configuration, utilizing Ge and Si as the absorption and avalanche multiplication regions respectively. The doping profile for the charge region was optimized using TCAD simulations to achieve high E-field in the multiplication region while maintaining enough E-field in Ge to extract photogenerated carriers.
2:Sample Selection and Data Sources:
The device consists of a 0.5 μm wide and 14.2 μm long Ge waveguide, fabricated on a 200 mm SOI wafer with 220 nm top Si layer on 2 μm thick buried oxide (BOX).
3:5 μm wide and 2 μm long Ge waveguide, fabricated on a 200 mm SOI wafer with 220 nm top Si layer on 2 μm thick buried oxide (BOX). List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: Agilent 50 GHz light wave component analyzer (N4373C), Agilent 50 GHz vector network analyzer (N5225A), Anritsu MU1812020B pulse pattern generators, MP1821A 50G/56G Gbps MUX, LiNbO3 modulator, 60 GHz RF probe, bias-Tee, 60 GHz Agilent remote sampling head, 80 GHz Agilent sampling scope.
4:Experimental Procedures and Operational Workflow:
Static measurements were carried out at room temperature to characterize the device's I-V characteristics and responsivity. Small signal RF measurements were performed to extract the 3 dB opto-electrical bandwidth and avalanche gain. Large-signal response was measured using pseudorandom binary sequence signals at 25, 40, and 50 Gbps data rates in NRZ-OOK modulation format.
5:Data Analysis Methods:
The responsivity of the APD was calculated by extracting the photocurrent and dividing it by the estimated optical power in the Si waveguide. The avalanche gain was estimated from the ratio of responsivity at high voltage over the responsivity at low voltage.
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Agilent sampling scope
80 GHz
Agilent
Used to display and analyze the electrical eye diagrams from large-signal response measurements.
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Agilent 50 GHz light wave component analyzer
N4373C
Agilent
Used for small signal RF measurements to characterize the device's frequency response.
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Agilent 50 GHz vector network analyzer
N5225A
Agilent
Used in conjunction with the light wave component analyzer for RF measurements.
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Anritsu pulse pattern generators
MU1812020B
Anritsu
Used to generate pseudorandom binary sequence signals for large-signal response measurements.
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MUX
MP1821A 50G/56G Gbps
Anritsu
Used to deliver the signal to drive a LiNbO3 modulator for large-signal response measurements.
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Agilent remote sampling head
60 GHz
Agilent
Used to sample the RF signal for large-signal response measurements.
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LiNbO3 modulator
Used to modulate the optical signal for large-signal response measurements.
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60 GHz RF probe
Used to acquire the RF signal from the device for large-signal response measurements.
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bias-Tee
Used in the signal acquisition chain for large-signal response measurements.
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