研究目的
Investigating the manufacturing of a flexible OLED display with 620(cid:1)C LTPS TFT and touch sensor using a weak bonding method to eliminate the PI substrate, aiming to improve display performance and reduce manufacturing costs.
研究成果
The weak bonding method successfully transfers a 1.8500 OLED display with 620(cid:1)C LTPS TFT and a 7.800 touch sensor to non-PI flexible substrates without defects, demonstrating normal functionality and low pitch variation. This method offers advantages in device stability and transparence over traditional PI substrate methods, with potential for cost reduction and application in flexible or stretchable electronics.
研究不足
The study focuses on the transfer process and initial functionality testing but may not address long-term durability under repeated bending or environmental stressors. The scalability of the weak bonding method to larger display sizes or different flexible substrates is not fully explored.
1：Experimental Design and Method Selection:
The study employs a weak bonding method to transfer OLED display and touch sensor thin films from glass substrates to non-PI flexible substrates.
2：Sample Selection and Data Sources:
OLED displays and touch sensors are manufactured on separate glass substrates.
3：List of Experimental Equipment and Materials:
Includes glass substrates, metal layers for weak bonding, LTPS TFT, OLED layers, multiencapsulation layers, and flexible substrates.
4：Experimental Procedures and Operational Workflow:
Involves treating glass substrates for low surface energy, depositing metal layers, manufacturing LTPS TFT and OLED layers, encapsulating, adhering a carrier substrate, applying mechanical stress for separation, laminating a flexible substrate, and testing the display and touch sensor functionality.
5：Data Analysis Methods:
Performance testing includes checking for defects, measuring pitch variations, and evaluating TFT stability and touch sensor functionality.
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