研究目的
Investigating the fabrication of high-resolution, high-aspect-ratio conductive networks on plastic substrates using roll-to-roll imprinting and the SCALE process.
研究成果
The research successfully demonstrated a method for fabricating high-resolution, high-aspect-ratio conductive networks on flexible substrates using roll-to-roll imprinting and the SCALE process. The conductors exhibited low resistance per length and were easily integrated into networks, offering a foundation for high-throughput manufacturing of printed electronics.
研究不足
The study faced challenges in achieving deeper channels with the recessed design due to the need for thicker UV-curable resin layers and potential buckling of high-aspect-ratio stamp features. The electroless plating process was identified as the slowest step in conductor fabrication.
1：Experimental Design and Method Selection:
The study utilized roll-to-roll UV imprinting with custom-made stamps to create high-aspect-ratio features in UV-curable resin. The SCALE process was employed for forming conductive networks.
2：Sample Selection and Data Sources:
Silicon wafer master patterns were used to fabricate imprinting stamps. UV-curable resin and silver ink were used for creating conductive networks.
3：List of Experimental Equipment and Materials:
Equipment included a roll-to-roll imprinting machine, inkjet printer, and electroless plating setup. Materials included UV-curable resin, silver ink, and copper plating solution.
4：Experimental Procedures and Operational Workflow:
The process involved stamp fabrication, roll-to-roll imprinting, inkjet printing of silver ink, and electroless copper plating.
5：Data Analysis Methods:
Characterization was performed using optical and SEM imaging, resistance measurements, and confocal microscopy.
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