研究目的
To highlight the role of nanotechnology in developing materials and manufacturing techniques to enable flexible systems and also focus on the emerging challenges.
研究成果
Flexible electronics have made significant advances in performance, reliability, cost reduction, and manufacturability. However, there is much room for further improvement in this area. A paradigm shift in design, hybrid substrate heterogeneous integration, fabrication, materials, and technologies is necessary to achieve the goal of full-system integration in next-generation flexible systems.
研究不足
Current flexible electronics are limited by the materials used for printing interconnects and traces on the substrate, which are not very malleable and do not have strong adhesion to substrates. There is also a tradeoff between trace resistance and bendability, requiring innovation in material formulations and process strategies.
