研究目的
Investigating the nanoscale scratching of silicon surfaces to improve surface quality and reduce sub-surface damage in various machining techniques.
研究成果
The phase transformation model accurately predicts the lateral force and the formation of an amorphous layer during scratching of silicon surfaces, showing good agreement with experimental data. This model can be used to study phenomena related to scratching and optimize machining parameters.
研究不足
The study focuses on nanoscale scratching and may not fully capture the effects at larger scales or different loading conditions. The constitutive model was calibrated for a specific indenter geometry and may require adjustments for other geometries.
1：Experimental Design and Method Selection:
Nanoscratching experiments were performed using a well-characterized diamond tip geometry. The finite element method was employed to simulate the scratching process with a continuum constitutive model developed for phase transformation in silicon.
2：Sample Selection and Data Sources:
A (111) single crystal Si wafer was used for the experiments. Material parameters were determined from indentation experiments.
3：List of Experimental Equipment and Materials:
A Berkovich indenter tip was used for scratching experiments. The finite element code Abaqus Standard was used for simulations.
4：Experimental Procedures and Operational Workflow:
The scratching tests were performed under displacement control. First, the displacement in the direction normal to the sample surface was applied; subsequently, the indenter was moved in scratching direction with a velocity of 10 nm/s and the lateral force and displacement were recorded.
5：Data Analysis Methods:
The simulation results were compared with experimental data to validate the constitutive model.
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