研究目的
To fabricate hysteresis-free 2D semiconductor transistors, NMOS and CMOS inverters by encapsulating 2D semiconductors with hexagonal boron nitride (hBN) to protect them from environmental factors.
研究成果
The hBN encapsulated few-layer MoS2 FET exhibited high performance with negligible hysteresis. The integrated NMOS inverter on a single MoS2 flake and CMOS inverter constructed with an n-MoS2 FET and p-WSe2 FET showed negligible hysteresis in the static voltage transfer characteristics. The NMOS inverter exhibited a high voltage gain, while the CMOS inverter exhibited a voltage gain of ≈3 at VDD = 1 V. These hysteresis-free vdWs heterostructures pave the way for 2D logical devices in next-generation electronics and computing.
研究不足
The limitations include the need for careful and deliberate design of the n- and p-channels’ threshold voltage to improve static power dissipations and the potential for increased voltage gain of the CMOS inverter by optimizing the performance of the p-WSe2 FET.