研究目的
Investigating the optical and morphological properties of environmentally benign Cu-Tin Sulphide Thin films grown by Physical Vapor Deposition Technique.
研究成果
The study concluded that the fabricated Tin Sulphide thin films, both doped and un-doped, exhibit properties suitable for optoelectronic devices, with variations in band gap and morphological characteristics influenced by doping concentrations.
研究不足
The study acknowledges the technical and application constraints of the experiments, including the potential for optimization in the fabrication process and the characterization of thin films.
1:Experimental Design and Method Selection:
The study involved the synthesis of Tin-Diethyl dithiocarbamate and Copper diethyldithiocarbamate complexes using a single source method, followed by the deposition of Tin Sulphide thin films via Physical Vapor Deposition (PVD) with varying concentrations of copper as a dopant.
2:Sample Selection and Data Sources:
Analytical grade solvents and chemicals were used without any purification. The fabricated films were subjected to analytical studies.
3:List of Experimental Equipment and Materials:
UV-Vis spectrophotometer (1602, Biomedical Services, Spain), X-ray diffraction studies at National Center for Physics (NCP), Islamabad, Fourier transform infrared spectrophotometer (FTIR) (8400, Shimadzu by Japan), scanning electron microscopy (SEM of Vega-3-Tescan) at Institute of space technology Islamabad (IST), Pakistan.
4:Experimental Procedures and Operational Workflow:
The synthesis and fabrication process included the preparation of diethyl-dithiocarbamate ligand, formation of tin and copper complexes, and deposition of thin films using PVD.
5:Data Analysis Methods:
Optical, structural, and morphological analyses were performed using UV-Vis, XRD, SEM, and EDX techniques.
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