研究目的
To address the issue of resist volume shrinkage during curing in ultraviolet nanoimprint lithography (UV-NIL) which influences pattern fidelity and induces defects in the demolding process due to strong adhesion.
研究成果
The novel UV-curable resist based on the copolymerization of DB-TOSU and epoxy monomers effectively reduces volume shrinkage and demolding force in UV-NIL, with potential for high-fidelity pattern replication and reduced demolding defects. Further optimization is needed to achieve a resist formulation with both low shrinkage and high mechanical strength.
研究不足
The resist cannot form a uniform film by spin-coating due to high surface energy and low viscosity, and high-quality pattern transfer cannot be achieved with 60 wt.% DB-TOSU due to extremely low elastic modulus of the resist.
1：Experimental Design and Method Selection:
The study involved the synthesis of a liquid spiro-orthocarbonate monomer (DB-TOSU) and its incorporation into UV-curable resist formulations at various weight ratios with conventional epoxy monomers. The resist formulations were characterized for volume shrinkage, elastic modulus, and demolding force.
2：Sample Selection and Data Sources:
The synthesized DB-TOSU was mixed with epoxy monomers and a photoacid generator (PAG) to prepare different resist formulations.
3：List of Experimental Equipment and Materials:
A UV LED source for curing, a universal testing machine for demolding force measurement, and nanoindentation equipment for elastic modulus measurement were used.
4：Experimental Procedures and Operational Workflow:
The volume shrinkage was measured by observing the contact angle change of resist droplets before and after UV curing. The elastic modulus was measured by nanoindentation. Nanoimprint and demolding force measurements were conducted using molds fabricated by photolithography or electron-beam lithography.
5：Data Analysis Methods:
The volume shrinkage was calculated based on contact angle changes. The elastic modulus and demolding force were directly measured and analyzed.
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