研究目的
The development of an FPGA based Ultrasonic Thickness measuring device for measuring the thickness of materials using ultrasonic testing techniques.
研究成果
The FPGA based thickness measuring device was successfully designed with necessary hardware and software implementations. Future work includes enhancing communication between FPGA and GUI, improving GUI functionalities, and making the device more portable and independent.
研究不足
The device failed to work synchronously when both signal generation and signal capturing are combined. The communication between FPGA and GUI is one way, limiting hardware control. Future enhancements include establishing two-way communication and improving GUI functionalities.
1：Experimental Design and Method Selection:
The design involves using a Spartan 6 FPGA for hardware design, with external parallel Analog to Digital and digital to Analog converters. Ultrasonic probes are used in pulse-echo mode for thickness measurement.
2：Sample Selection and Data Sources:
Materials like mild steel and Cast Iron of different thicknesses are used for testing.
3：List of Experimental Equipment and Materials:
Spartan XC6SLX9 FPGA board, High speed 14 bit 125MSPS dual channel DAC module, High speed 12 bit dual channel ADC module, Ultrasonic probes.
4：Experimental Procedures and Operational Workflow:
The FPGA generates a pulse signal through the DAC module, which is converted to ultrasonic waves by the transducer. The reflected waves are captured by the ADC module and processed to calculate thickness based on Time of Flight (ToF).
5：Data Analysis Methods:
The GUI developed in .NET is used to visualize the signals and compute results based on ToF calculations.
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