研究目的
To review thermal management strategies for GaN-based high-power electronic and photonic devices, focusing on thermal metrology techniques, thermal management solutions for power electronics, and packaging techniques for LEDs in automotive applications.
研究成果
The paper concludes that effective thermal management is crucial for the performance and reliability of GaN-based high-power devices in automotive applications. It summarizes the advantages and limitations of various thermal metrology techniques and thermal management strategies, emphasizing the need for continued innovation in substrate materials, device design, and packaging techniques to address thermal challenges.
研究不足
The review highlights challenges such as the complexity of accurately measuring junction temperatures due to device material diversity and geometry restrictions, the high cost of certain substrates like SiC and diamond, and the need for improved thermal management solutions to enhance device reliability and performance under high-power conditions.
