研究目的
To develop a methodology to measure the actual thermal bridging performance based on infrared thermography technique for existing buildings with unknown structure.
研究成果
The methodology presented allows quantifying the heat flow rate through a thermal bridge and the W-value by means of the infrared thermography technique solely, without using any tabulated values or other measurements methods. It has been validated under laboratory conditions with good agreement, ensuring the correctness of the method and the possibility to apply it in real buildings.
研究不足
The methodology has been validated under laboratory conditions, and its application in real buildings may require further validation. The high level of accuracy depends on precise calculation of convective and radiative heat transfer coefficients for each pixel.
1：Experimental Design and Method Selection:
The methodology is based on the energy balance, equating the rate at which energy is transferred to/from the surface in conductive mode to the rate at which it is transferred from/to the surface in convective and radiative modes, under steady state conditions.
2：Sample Selection and Data Sources:
A specimen with a thermal bridge was purpose-built for the tests.
3：List of Experimental Equipment and Materials:
Infrared camera, hot box apparatus, thermocouples, structural insulated panels (SIP) consisting of extruded polystyrene insulation (XPS) covered with oriented strandboard (OSB), and a steel square hollow section (SHS) post.
4：Experimental Procedures and Operational Workflow:
The methodology was validated under laboratory conditions in the hot box apparatus, allowing controlling the ambient conditions.
5：Data Analysis Methods:
The heat flow rate for each pixel was calculated using temperature-dependent surface heat transfer coefficients.
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