研究目的
To fabricate pure Cu films strongly adhered on glass substrates by printing a paste containing Cu(COOH)2 and inducing its decomposition at 250 °C under a nitrogen atmosphere, achieving optimal adhesion properties and superior electrical conductivity.
研究成果
Pure Cu films strongly adhered on glass substrates were fabricated by printing a paste containing Cu(COOH)2 and inducing its decomposition at 250 °C under a nitrogen atmosphere. The mixing ratio of Cu complexes:α-terpineol was a crucial factor governing the adhesion properties, with the most optimal adhesion at the 6:4 weight ratio. A spike-shaped microstructure at the Cu/glass interface was the main cause for the outstanding adhesion properties. The sheet resistance decreased to 0.084 Ω/sq after electroless Cu plating, confirming the feasibility of the proposed low-temperature and low-cost process for the formation of Cu conductors or electrode patterns on glass substrates.
研究不足
The sintered Cu films did not exhibit dense structures, even after 60 min of heating. The upper portions of the formed Cu films could easily be removed by dusting while applying little external force. The outgassing of CO2 and H2 hindered sintering between Cu grains as the sintering region was close to the surfaces of the films, resulting in the formation of a fragile upper structure.
1：Experimental Design and Method Selection:
Cu complexes were synthesized using a mechanochemical method. The paste containing Cu complexes was prepared by mixing specific weight ratios of Cu complexes and α-terpineol. The paste was then screen-printed on a glass substrate, followed by heating at 250 °C under a nitrogen atmosphere to decompose the Cu complexes and form a pure Cu film. Electroless Cu plating was also conducted to deposit an additional Cu coating on the already formed Cu films.
2：Sample Selection and Data Sources:
Cu2O powder and formic acid were used to synthesize Cu complexes. The resultant slurry was separated by filtration, washed with ethanol, and dried under vacuum.
3：List of Experimental Equipment and Materials:
Planetary mill, tube furnace, SEM (SU8010, JEOL Ltd.), XRD (DE/D8 Advance, Bruker), AES (PHI-700, ULVAC-PHI), four-point probe connected to a source meter (2400, Keithley Instruments).
4：Experimental Procedures and Operational Workflow:
The paste was screen-printed on a glass substrate and heated at 250 °C under a nitrogen atmosphere. Electroless Cu plating was performed for 3 min at pH 12.5 and 60 °C.
5：5 and 60 °C.
Data Analysis Methods:
5. Data Analysis Methods: The microstructures of the synthesized Cu complex particles and final films were examined by SEM, and the crystal structures were analyzed by XRD. The depth profiles of elements at the Cu film/glass interface were examined using AES. The adhesion properties were evaluated by inspecting the Cu films deposited on glass after removing them using adhesive tape. The sheet resistance of the formed films was measured using a four-point probe.
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