研究目的
Investigating the electromagnetic modeling and analysis of the tapered differential through glass vias for high-frequency applications.
研究成果
The proposed analytic model of differential through glass vias shows good agreement with simulation results up to 20 GHz, demonstrating excellent transmission characteristics. The study provides insights into the impact of different configurations on transmission coefficients, guiding the application and structure design of TGV substrates at high frequencies.
研究不足
The study is limited to frequencies up to 20 GHz and does not explore the effects beyond this range. The model's accuracy is validated against simulations, but real-world fabrication and measurement variations are not considered.
1：Experimental Design and Method Selection:
The study involves deriving analytic expressions for parasitic parameters of differential TGVs and proposing an equivalent circuit model. The methodology includes basic physics principles and the inclusion of the IMD layer.
2：Sample Selection and Data Sources:
The study uses theoretical models and simulations to validate the proposed model, comparing S-parameters from the model with those from HFSS and ADS simulations.
3：List of Experimental Equipment and Materials:
The study mentions the use of High Frequency Simulator Structure (HFSS) and Advanced Design System (ADS) for simulations.
4：Experimental Procedures and Operational Workflow:
The study involves comparing S-parameters from the proposed model with simulation results up to 20 GHz and using the feature selective validation (FSV) technique for quantitative comparison.
5：Data Analysis Methods:
The study uses the FSV technique to quantitatively describe the comparison between the proposed model and simulation results.
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