研究目的
To assess the electrical properties of different molding-compound materials with high filler contents through dielectric spectroscopy and steady-state conduction measurements.
研究成果
The study found that the filler content affects the dielectric properties and conductivities of the materials, with larger interface regions between filler particles leading to increased conductivity and enhanced electric field dependence. The analysis provides a foundation for further reliability studies, though long-term electro-thermal ageing studies would be necessary for a complete characterization.
研究不足
The study was limited to two types of molding compounds with high filler contents. The detailed chemical formulation of the materials was not shared, which could limit the interpretation of the results. The experimental setup's maximum operating temperature was 120 °C, restricting the temperature range for DC current analysis.
1：Experimental Design and Method Selection:
The study focused on dielectric spectroscopy and steady-state conduction measurements to investigate the electrical properties of materials at different frequencies, temperatures, and electric fields.
2：Sample Selection and Data Sources:
Two different molding compounds based on the same epoxy matrix were investigated, labeled MC0 and MC1, containing different fractions of silica fillers.
3：List of Experimental Equipment and Materials:
Equipment included a Novocontrol Concept 80 alpha analyzer for dielectric spectroscopy, a Keithley-6514 electrometer for DC current analysis, and spherical electrodes for dielectric strength measurements.
4：Experimental Procedures and Operational Workflow:
Dielectric spectroscopy was carried out in a frequency range from 102 Hz to 106 Hz at different ambient temperatures. DC current measurements were performed at temperatures ranging from 25 °C to 120 °C.
5：Data Analysis Methods:
The complex dielectric function ε* was analyzed to extract relaxation times and conductivity contributions. The relationship between current and electric field was analyzed to identify transport mechanisms.
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