研究目的
To develop a sacrificial layer technique using AZ 15nXT for releasing metallized multilayer SU-8 devices, addressing the limitations of existing sacrificial materials in microfabrication.
研究成果
AZ 15nXT is an effective sacrificial layer for multilayer SU-8 devices, offering stability during processing and efficient release. The developed methods enable fabrication of free-standing devices with metallization, demonstrated through successful ESI chip and metallized device applications. Future work could focus on further optimizing cross-linking parameters and expanding to other microfabrication processes.
研究不足
The release process can be time-consuming (e.g., overnight immersion for Method 1), and thermal shock method leaves more residues on the silicon wafer, requiring additional cleaning. The stability of AZ 15nXT depends on cross-linking conditions, which may need optimization for different applications.
1：Experimental Design and Method Selection:
The study uses AZ 15nXT as a sacrificial layer for fabricating free-standing multilayer SU-8 devices. Two cross-linking methods (UV exposure and thermal curing) and three release etch techniques (immersion in TechniStrip NI555 at room temperature, heated to 60°C, and thermal shock) are employed.
2：Sample Selection and Data Sources:
Silicon wafers (100 mm diameter, <100> orientation) are used as substrates. SU-8 photoresist and AZ 15nXT are the main materials.
3：List of Experimental Equipment and Materials:
Equipment includes spin coaters, programmable hot plates (e.g., HP-220 from Unitemp GmbH), mask aligners (e.g., Suss MicroTech MA-6), sputtering systems (e.g., Plasmalab 400 from Oxford Instruments), and mass spectrometers (e.g., Agilent 6300 Series Ion Trap). Materials include SU-8 50, AZ 15nXT, TechniStrip NI555, and various chemicals.
4：Experimental Procedures and Operational Workflow:
The process involves cleaning wafers, spin-coating and cross-linking AZ 15nXT, fabricating multiple SU-8 layers with lithography steps, metallization (if applicable), and sacrificial release using TechniStrip.
5：Data Analysis Methods:
Performance is evaluated through mass spectrometry measurements for ESI chips, analyzing limit of detection and correlation factors.
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Mask Aligner MA-6
MA-6
Suss MicroTech
Used for UV exposure in lithography steps.
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Sputtering System Plasmalab 400
Plasmalab 400
Oxford Instruments
Used for metallization by sputtering Cr and Al layers.
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Mass Spectrometer Agilent 6300 Series Ion Trap
6300 Series
Agilent
Used for mass spectrometry measurements to evaluate device performance.
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AZ 15nXT
450 CPS
MicroChemicals GmbH
Used as a sacrificial layer for releasing multilayer SU-8 devices, providing stability during SU-8 processing.
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TechniStrip NI555
NI555
MicroChemicals GmbH
Solvent used for sacrificial release etching of AZ 15nXT.
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SU-8 50
SU-8 50
Microresist Technologies GmbH
Negative photoresist used for fabricating multilayer devices.
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mr-DEV-600
mr-DEV-600
Microresist Technologies GmbH
Developer for SU-8 photoresist.
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AZ 5412E
AZ 5412E
MicroChemicals GmbH
Used for lift-off patterning in metallization steps.
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MIF 312 developer
MIF 312
MicroChemicals GmbH
Developer for photoresists.
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Hot Plate HP-220
HP-220
Unitemp GmbH
Programmable hot plate for baking processes.
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