研究目的
Investigating the potential of spoof surface plasmon polariton (SSPP) interconnects as an energy-economic solution for inter-chip communication, capable of operating in both electrical and quasi-optical modes to overcome the limitations of conventional interconnects.
研究成果
SSPP interconnects offer a promising solution for high-bandwidth, energy-efficient inter-chip communication, with a bandwidth density of 1 Gbps/μm and information transfer up to 10 mm per channel at 300 Gbps. The technology combines advantages of electrical and optical interconnects, enabling dynamic mode switching for varying data traffic demands.
研究不足
The analysis is theoretical and assumes ideal conditions; practical fabrication challenges, material imperfections, and integration with existing CMOS technology are not addressed. The study focuses on thermal noise but may not account for other noise sources or real-world impairments.
1:Experimental Design and Method Selection:
The study employs theoretical modeling and analysis of SSPP interconnects, including dispersion relations, bandwidth density optimization, and cross-talk suppression. Numerical simulations using FDTD in COMSOL Multiphysics are used to validate theoretical models.
2:Sample Selection and Data Sources:
The analysis is based on geometric parameters of SSPP structures (e.g., groove length h, period d, width a) and material properties (e.g., gold for conductivity). No specific experimental samples are described; the work is theoretical.
3:List of Experimental Equipment and Materials:
No specific equipment or materials are listed for experiments, as the paper is theoretical. COMSOL Multiphysics software is used for simulations.
4:Experimental Procedures and Operational Workflow:
The methodology involves deriving equations for bandwidth density, propagation length, and noise characteristics, followed by numerical evaluation and comparison with optical and electrical interconnects.
5:Data Analysis Methods:
Analytical methods include solving dispersion relations, calculating Shannon information capacity, and bit error rate. Numerical simulations provide validation.
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