研究目的
To investigate a novel method for welding molybdenum and copper in micro devices using laser impact welding (LIW), focusing on microstructure and mechanical properties.
研究成果
Laser impact welding successfully joined molybdenum and copper, with improved welding quality at higher laser energies. Interface waves transitioned from flat to zigzag shapes, no elemental diffusion was observed, tensile strength increased with energy, and nano-hardness near the interface significantly increased. This method shows promise for microelectronics applications but requires further optimization and scaling studies.
研究不足
The study is limited to specific laser energies and material thicknesses; it may not generalize to other parameters or materials. The small sample size and focus on micro-scale welding could limit applicability to larger scales. Environmental and safety aspects of LIW were not fully addressed.
1:Experimental Design and Method Selection:
Laser impact welding (LIW) was used as a solid-state process to join molybdenum and copper. The method involves using a pulsed laser to generate plasma that accelerates a flyer plate to impact the base plate, forming a weld without melting.
2:Sample Selection and Data Sources:
Pure molybdenum (0.1 mm thick) and pure copper (0.03 mm thick) foils were used. Copper foils were annealed at 720 K for 2 hours. Samples were cut to sizes of 20 mm x 20 mm for base plates and 20 mm x 5 mm for flyer plates, polished, and cleaned with alcohol.
3:1 mm thick) and pure copper (03 mm thick) foils were used. Copper foils were annealed at 720 K for 2 hours. Samples were cut to sizes of 20 mm x 20 mm for base plates and 20 mm x 5 mm for flyer plates, polished, and cleaned with alcohol. List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: Equipment includes a short pulse Nd:YAG laser (Spotlight 2000), optical microscope (KEYENCE VHX-1000C), scanning electron microscope (SEM, Hitachi), energy dispersive spectroscopy (EDS, EDAX), tensile shear testing machine (Instron Type UTM 4104), and nanoindenter (NanoIndenter CSM). Materials include molybdenum and copper foils, black paint (ablative layer), K9 glass (confinement layer), cyanoacrylate adhesive (Loctite 380), and epoxy resin for sample preparation.
4:Experimental Procedures and Operational Workflow:
The LIW setup involved placing the base plate on a support, adjusting standoff distance, applying ablative and confinement layers, and using a laser with energies of 565, 835, 1200, and 1550 mJ at a spot diameter of 1.5 mm. After welding, samples were cleaned, cut, and prepared using cold inlay technology for microscopy and testing. Microstructure was observed with optical microscope and SEM, elemental diffusion with EDS, tensile shear tests at 1 mm/min speed, and nanoindentation hardness measurements with a Berkovich indenter.
5:5 mm. After welding, samples were cleaned, cut, and prepared using cold inlay technology for microscopy and testing. Microstructure was observed with optical microscope and SEM, elemental diffusion with EDS, tensile shear tests at 1 mm/min speed, and nanoindentation hardness measurements with a Berkovich indenter. Data Analysis Methods:
5. Data Analysis Methods: Data from microscopy and EDS were analyzed qualitatively for interface morphology and elemental distribution. Tensile shear test data were plotted as force-time curves, and nanoindentation hardness values were averaged from multiple measurements.
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Scanning Electron Microscope
SEM
Hitachi
Observing morphology and microstructure of welding interface
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Nanoindenter
NanoIndenter CSM
Anton Paar
Measuring micro-hardness in welding area
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Nd:YAG Laser
Spotlight 2000
Generating pulsed laser beams for laser impact welding
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Optical Microscope
VHX-1000C
KEYENCE
Observing morphology and transversal surface of welding samples
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Energy Dispersive Spectroscopy
EDS
EDAX
Analyzing elemental diffusion at welding interface
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Tensile Testing Machine
UTM 4104
SUNS
Conducting tensile shear tests on welded specimens
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Cyanoacrylate Adhesive
Loctite 380
Loctite
Sticking flyer plate to ablative layer
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Epoxy Resin
Used in cold inlay technology for sample preparation
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