研究目的
To investigate the application of aerosol jet 3D printing with conductive and non-conductive inks for the realization of fully-additive manufactured mm-wave circuits operating above 30 GHz, including transmission lines, T-junction power dividers, and branch-line couplers.
研究成果
The experimental results demonstrate that aerosol jet 3D printing is a feasible technology for high-performance, low-loss mm-wave circuit fabrication, with measured losses comparable or better than existing methods. The approach offers high resolution, material flexibility, and 3D capabilities, making it promising for rapid prototyping and cost-effective manufacturing in mm-wave applications.
研究不足
The technology is emerging and requires further development; discrepancies in substrate thickness and permittivity from design assumptions led to frequency shifts in circuit performance; surface roughness of printed layers could be improved; the process may have variations in line widths and spacing; curing profiles and materials may need optimization for specific applications.
1：Experimental Design and Method Selection:
The study utilized aerosol jet 3D printing technology for additive manufacturing of microstrip circuits. Circuits were designed using NI AWR Design Environment software, including a via-less CPW to microstrip transition, a T-junction power divider, and a branch-line coupler, optimized for operation in Ka and V bands.
2：Sample Selection and Data Sources:
Samples were fabricated on a copper sheet substrate using polyimide ink for the dielectric and silver ink for conductive traces.
3：List of Experimental Equipment and Materials:
Equipment includes the Optomec Aerosol Jet 5X System, Keysight PNA Network Analyzer N5227A, GGB Industries GSG CPW probes, Virginia Diodes VNA Extender, Olympus BX41M microscope, and AEP Technology NanoMap-500LS profilometer. Materials include polyimide ink (5% polyamic acid in NMP), Clariant Prelect TPS 50 silver nanoparticle ink, and a copper ground plane.
4：Experimental Procedures and Operational Workflow:
The dielectric substrate was built by printing 25 layers of polyimide ink using a 300 μm nozzle, cured in a nitrogen environment. Silver ink was printed in three layers using a 100 μm nozzle and sintered. Printing parameters (flow rates, temperatures) were optimized. Electrical performance was measured up to 110 GHz using network analyzers and probes with SOLT calibration.
5：Data Analysis Methods:
S-parameters were measured and analyzed to determine return loss, insertion loss, and total loss. Post-manufacturing simulations were performed using NI AWR AXIEM EM solver to validate results and estimate material properties.
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