研究目的
To isolate the metallization-encapsulant interface and study the mechanisms of adhesion degradation individually to quantify their relative contribution to observed field failures in photovoltaic modules.
研究成果
Adhesion degradation at the EVA/silver metallization interface is severe under humidity and voltage bias exposures, with mechanisms involving sodium silicate formation from ionic conduction and silane dissociation from moisture. The adhesion drops below the 160 J/m2 threshold required for module reliability, indicating potential for delamination. Future work should explore mitigation strategies and broader material sets.
研究不足
The study focuses on specific conditions (e.g., 85°C, various RH levels, -1000 V bias) and may not cover all possible environmental factors. The use of accelerated aging might not fully replicate long-term field conditions. Sample preparation and testing could introduce minor artifacts, and the findings are specific to the materials used (e.g., EVA encapsulant, silver metallization).
1：Experimental Design and Method Selection:
The study involved fabricating single wafer modules with monocrystalline silicon wafers screen-printed with silver paste and laminated with EVA encapsulant and glass. Exposures to temperature, humidity, and voltage bias were conducted to simulate environmental aging. The width-tapered cantilever beam method was used for adhesion measurements, and X-ray photoelectron spectroscopy (XPS) was employed for chemical characterization.
2：Sample Selection and Data Sources:
Monocrystalline silicon wafers were used, prepared by screen printing with silver paste. Modules were exposed to various conditions: 85°C with 0%, 13.5%, 40%, and 85% RH, voltage bias of -1000 V, and outdoor exposure in Golden, Colorado.
3：5%, 40%, and 85% RH, voltage bias of -1000 V, and outdoor exposure in Golden, Colorado.
List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: Equipment includes a PHI Versa Probe XPS instrument with Al (Kα) source, C60 sputtering gun, load frame for mechanical testing, carbide scribe for sectioning, and materials such as EVA encapsulant, silver paste, solar glass, titanium beams, and epoxy (3M DP420).
4：0).
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: Modules were fabricated, exposed to aging conditions, and tested at intervals. For mechanical testing, width-tapered beams were adhered to cells, and debond energy was measured. For XPS, samples were prepared in a glove box to prevent ambient exposure, and spectra were analyzed using CasaXPS software.
5：Data Analysis Methods:
Adhesion energy (Gc) was calculated using the formula provided. XPS data were calibrated and analyzed for chemical composition changes, with statistical analysis of adhesion measurements including averages and standard deviations.
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