研究目的
To produce a solvent-free transparent epoxy modified silicone resin coating with high transparency and low volume shrinkage using UV curing method and investigate its properties.
研究成果
The UV-cured epoxy modified silicone resin coatings exhibit high transparency (>95% transmittance), good thermal stability (decomposition temperatures around 409°C), good adhesive ability (grade 1 to 0 for R/Si=1.6), and low volume shrinkage (as low as 0.26%), making them suitable for applications requiring these properties. Future studies could focus on scaling up and additional performance tests.
研究不足
The study is limited to specific R/Si ratios and UV curing conditions; potential optimizations could include exploring other initiators or curing parameters to enhance properties further.
1：Experimental Design and Method Selection:
The study involved synthesizing UV-curable epoxy modified silicone resins and curing them using UV light to investigate curing time, initiator amount, and R/Si ratio effects on properties like transparency, hardness, adhesion, and shrinkage.
2：Sample Selection and Data Sources:
Epoxy modified silicone resins were prepared based on a reference, with specific R/Si ratios (
3：4 to 7). Materials included γ-(2,3-epoxypropoxy)propytrimethoxysilane and dimethyldiethoxylsilane. List of Experimental Equipment and Materials:
Equipment included a spin-coater (rotate speed 3000 r/s), UV curing system (ZB1000, wavelength 405 nm, power 1000 W), FT-IR spectrometer (Perkin-Elmer FT-IR 2000), UV/Vis spectrophotometer (Unico UV-4802), pencil hardness meter (BGD-562), adhesion tester (BGD-502), TGA apparatus (TG 209C), DSC apparatus (DSC Q100), and Soxhlet extraction setup. Materials included UV initiator 1176, KBr pellets, and toluene for extraction.
4：Experimental Procedures and Operational Workflow:
Mixtures of resins and initiator were spin-coated on slides, cured with UV light for varying times, and characterized using FT-IR, transmittance measurements, hardness and adhesion tests, TGA, DSC, and Soxhlet extraction. Volume shrinkage was measured based on a reference method.
5：Data Analysis Methods:
Data were analyzed using FT-IR peak ratios (A910/A1040), Soxhlet extraction for curing degree, standard methods for hardness and adhesion, and thermal analysis for Tg and decomposition.
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FT-IR spectrometer
FT-IR 2000
Perkin-Elmer
Used for Fourier-transform infrared spectroscopic analysis to characterize the cured resins.
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UV/Vis spectrophotometer
UV-4802
Unico Instrument Co., Ltd.
Used to measure transmittance spectra of the silicone resins.
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Pencil hardness meter
BGD-562
Zhenwei Testing Machinery Co Ltd
Used to measure the pencil hardness of the cured samples according to standard methods.
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Adhesion tester
BGD-502
Used to measure the adhesion of the paint film according to ISO standards.
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TGA apparatus
TG 209C
Used for thermogravimetric analysis to study thermal stability.
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DSC apparatus
DSC Q100
Used for differential scanning calorimetry to measure glass transition temperatures.
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UV curing system
ZB1000
Changzhou Zibo Electron Technology Co., Ltd
Used to cure the epoxy modified silicone resins with UV light.
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Spin-coater
Used to deposit resin mixtures on slides with controlled thickness.
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UV initiator
1176
Chitec Technology Co., Ltd.
Used as the photoinitiator for the UV curing process.
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γ-(2,3-epoxypropoxy)propytrimethoxysilane
Hubei Xinlantian Co., Ltd.
Raw material for synthesizing the epoxy modified silicone resin.
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Dimethyldiethoxylsilane
Shanghai Jiancheng Industry and Trade Co., Ltd.
Raw material for synthesizing the epoxy modified silicone resin.
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