研究目的
To improve the hole transporting properties at the ITO/CIGS back contact for bifacial CIGS photovoltaics by controlling Na doping and reducing GaOx formation.
研究成果
Na doping, particularly when incorporated during GaOx formation, significantly improves the electrical properties of the ITO/CIGS interface by creating defective states that facilitate hole transport. Reducing ITO thickness minimizes GaOx formation, and post-Na treatment can convert Schottky junctions to ohmic contacts. These findings are crucial for developing high-efficiency bifacial CIGS solar cells.
研究不足
The study is limited to ITO back contacts and specific CIGS deposition conditions at 450°C. The exact mechanism of GaOx thickness dependency on ITO thickness is not fully explained. The scalability and long-term stability of the devices are not addressed. The use of specific materials and processes may not be universally applicable.
1:Experimental Design and Method Selection:
The study uses a reduced temperature of 450°C for CIGS deposition to suppress GaOx formation. Na doping is controlled via NaF post-deposition treatment (PDT) and diffusion from soda-lime glass. Various ITO back contact structures are fabricated and characterized.
2:Sample Selection and Data Sources:
Samples include CIGS solar cells with different ITO thicknesses (200 nm and 600 nm), with and without Mo or SiOx layers, and with or without NaF PDT. Data is collected from photovoltaic performance measurements, TEM, SIMS, XPS, UPS, PL, and other analyses.
3:List of Experimental Equipment and Materials:
ITO films deposited by RF magnetron sputtering, CIGS films by co-evaporation, NaF for PDT, CdS buffer by CBD, i-ZnO and AZO by RF sputtering, Ni-Al grid by e-beam evaporation. Characterization equipment includes TEM (Talos F200X), SIMS (Cameca IMS-4FE7), XPS/UPS (PHI 5000 VersaProbe), PL system with DPSS laser and monochromator, j-V measurement setup with Keithley source meter, and cryostat for temperature-dependent measurements.
4:Experimental Procedures and Operational Workflow:
ITO films are prepared on SLG or SLG/SiOx substrates. CIGS is deposited at 450°C using a modified three-stage co-evaporation process. NaF PDT is applied post-deposition. Devices are fabricated with CdS, i-ZnO, AZO, and Ni-Al grid. Performance is measured under AM 1.5 illumination. Interface structures are analyzed via TEM and EDS. Elemental and electronic properties are probed with SIMS, XPS, UPS, and PL.
5:5 illumination. Interface structures are analyzed via TEM and EDS. Elemental and electronic properties are probed with SIMS, XPS, UPS, and PL. Data Analysis Methods:
5. Data Analysis Methods: j-V curves are analyzed for photovoltaic parameters. DLCP is used for carrier density profiling. TEM and EDS provide structural and compositional data. XPS and UPS give electronic structure information. PL spectra are analyzed for defect states.
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transmission electron microscope
Talos F200X
FEI
Structural analysis of interfaces
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dual-beam focused-ion-beam equipment
Helios Nano-Lab 600
FEI
Sample preparation for TEM
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radio-frequency magnetron sputtering system
Deposition of ITO thin films
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plasma-enhanced chemical vapor deposition system
Deposition of SiOx layer
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co-evaporation system
Deposition of CIGS films
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chemical bath deposition system
Deposition of CdS buffer layers
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e-beam evaporation system
Formation of Ni-Al grid
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secondary ion mass spectrometer
IMS-4FE7
Cameca
Elemental depth profiling
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X-ray photoemission spectrometer
PHI 5000 VersaProbe
Ulvac-PHI
Surface chemical analysis
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ultraviolet photoemission spectrometer
PHI 5000 VersaProbe
Ulvac-PHI
Work function measurement
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photoluminescence system
SpectraPro 2300I monochromator
ACTON Research Corporation
Optical characterization
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cryostat
LTS420E-P
Linkam
Temperature-dependent measurements
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source meter
2400
Keithley Instruments
Current-voltage measurements
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impedance analyzer
HP4284
HP
Drive-level capacitance profiling
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