研究目的
To design, fabricate, and measure a compact size multi-channel true time delay (TTD) module with high accuracy for applications in active phased array systems, such as radar, to prevent beam squinting in wideband scenarios.
研究成果
The designed TTD module achieves high integration, compact size, and excellent time-delay accuracy, making it suitable for T/R modules and beamforming applications in phased array systems. Future work could focus on enhancing performance or applying it to broader frequency bands.
研究不足
The paper does not explicitly mention limitations, but potential areas for optimization could include further miniaturization, cost reduction, or extending the frequency range beyond the tested band.
1：Experimental Design and Method Selection:
The module integrates true time delay units, bi-directional amplifiers, serial-to-parallel converter, and power pulse modulated circuits using multi-chip module (MCM) technology with MMIC and SMT. Multi-layer microwave board is used for signal routing. Distributed amplifiers and high isolation cavity structures are adopted for flatness and accuracy. Electromagnetic simulation is used for cavity isolation analysis.
2：Sample Selection and Data Sources:
A specific multi-channel TTD module is designed and fabricated as the sample for measurement.
3：List of Experimental Equipment and Materials:
MMICs (based on GaAs technology), multi-layer microwave board (composed of FR4 and RO4350B), cavity structures, and measurement equipment for gain, power, and time-delay accuracy.
4：Experimental Procedures and Operational Workflow:
The module is fabricated using MCM packaging. Measurements include receive gain, transmit power, and time-delay accuracy across different states and frequencies.
5：Data Analysis Methods:
Measured data is analyzed to verify performance metrics such as gain flatness, power output, and time-delay accuracy using standard measurement techniques.
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获取完整内容-
multi-chip module
MCM
Integration of true time delay units, bi-directional amplifiers, serial-to-parallel converter, and power pulse modulated circuits for high integration and miniaturization.
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monolithic microwave integrated circuit
MMIC
Used for true time delay and amplification functions, based on GaAs technology.
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surface mount technology
SMT
Used for packaging and integration of components in the module.
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multi-layer microwave board
Implements routing of DC, control, and RF signals, composed of FR4 and RO4350B materials.
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distributed amplifier
Reduces RF signal spatial feedback and improves dynamic range in the receiver channel.
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cavity structure
Provides high spatial isolation to reduce signal feedback and improve time delay flatness.
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electromagnetic simulation software
Used to calculate spatial isolation of cavity structures.
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