摘要： In the aerospace manufacturing industry, it is impossible to achieve precise and efficient automatic drilling and riveting for largescale composite board parts. The bottleneck is that the depth detection of rivet holes still relies on manual operation, which seriously affects the assembly efficiency and stability of composite board parts. In order to realize accurate and efficient on-machine automatic measurement for through holes in the automatic drilling and riveting process of largescale composite board parts, this paper presents a novel hole depth measuring device. Its mechanical structure is developed based on our newly designed measurement scheme and optical path, the purpose of which is to convert the hole depth data into displacement data of the probe motion. Its electrical hardware consists of three units: a laser transceiver unit to pick up laser spots; a displacement measuring unit to capture the probe movement in real time; and a driving unit to achieve motion control of the probe. Finally, the experimental results indicated that the proposed method and device are capable of performing automatic measurements for through-hole depth. In addition, factors affecting the measuring accuracy and stability of the device are initially analyzed and discussed, which lay a foundation for subsequent research on error compensation and probe calibration.