研究目的
To demonstrate hysteresis-free negative capacitance in ferroelectric Hf0.5Zr0.5O2 films using high-speed pulsed charge-voltage measurements and to extract Landau parameters for device modeling.
研究成果
Hysteresis-free negative capacitance in HZO/Al2O3 stacks was demonstrated down to 100 ns pulse widths, with S-shaped P-E curves enabling direct fitting of Landau coefficients. Thinner Al2O3 films showed increased hysteresis, highlighting the importance of capacitance matching for practical NC devices in digital applications.
研究不足
The measurement setup limits the pulse width to 100 ns due to RC delay; shorter pulses were not possible. Hysteresis was observed for thinner Al2O3 layers (<1.8 nm) due to capacitance mismatch and potential charge trapping effects.
1:Experimental Design and Method Selection:
The study used pulsed charge-voltage measurements to investigate negative capacitance in HZO films with Al2O3 layers, based on Landau theory to model the S-shaped polarization-electric field curve.
2:Sample Selection and Data Sources:
MFM and MFIM capacitors were fabricated on Si substrates with varying thicknesses of HZO (7.7 nm and 11.3 nm) and Al2O3 (0.5 nm to 4 nm).
3:7 nm and 3 nm) and Al2O3 (5 nm to 4 nm). List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: Equipment includes a BESTEC physical vapor deposition tool, Oxford Instruments OpAL ALD tool, Bruker D8 Discover X-ray diffractometer, Zeiss Libra 200 TEM, Cascade Microtech Probe Station, Keithley 4200 SCS with 4225-PMU, HP 8110A pulse generator, and Tektronix TDS7154B digital oscilloscope. Materials include TiN electrodes, HZO and Al2O3 films deposited by ALD, and precursors like TEMA-Hf, TEMA-Zr, TMA, and water.
4:Experimental Procedures and Operational Workflow:
Fabrication involved sputtering TiN electrodes, ALD of HZO and Al2O3, annealing at 600°C, and defining capacitor pads. Electrical measurements included standard P-E hysteresis, capacitance-voltage, and pulsed Q-V measurements using pulse generators and oscilloscopes.
5:Data Analysis Methods:
Data were analyzed by integrating current to obtain charge, calculating electric fields, and fitting to Landau theory equations to extract parameters like α and β.
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Atomic Layer Deposition Tool
OpAL
Oxford Instruments
Used for growing HZO and Al2O3 films by ALD at 260°C.
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X-ray Diffractometer
D8 Discover
Bruker
Used for X-ray reflectometry and grazing-incidence X-ray diffraction measurements for structural analysis.
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Transmission Electron Microscope
Libra 200
Zeiss
Used for TEM analysis to examine sample cross-sections and structures.
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Semiconductor Characterization System
4200 SCS
Keithley
Used for electrical measurements, including with a 4225-PMU and remote amplifier.
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Digital Oscilloscope
TDS7154B
Tektronix
Used to measure current and voltage during pulsed measurements.
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Physical Vapor Deposition Tool
BESTEC
BESTEC
Used for reactively sputtering TiN bottom electrodes at room temperature.
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Probe Station
Cascade Microtech
Used for electrical measurements in conjunction with other instruments.
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Pulse Generator
8110A
HP
Used to apply voltage pulses for pulsed charge-voltage measurements.
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