研究目的
To develop a completely aqueous and green chemistry route for metallizing structural polymeric materials, specifically KMPR photoresist, in micro-electro-mechanical systems (MEMS) using a one-step diazonium-based process for covalent grafting of aminophenyl layers, enabling electroless nickel plating and subsequent copper electroplating without vacuum-based methods.
研究成果
The one-step aqueous diazonium process successfully grafts aminophenyl layers onto KMPR, enabling effective activation and electroless nickel plating with good adhesion. The nickel-boron film serves as a conductive seed layer for copper electroplating, demonstrating a vacuum-free method for metallizing polymers in MEMS applications. This green chemistry approach is efficient and can be extended to other polymers, contributing to advancements in semiconductor and MEMS fabrication.
研究不足
The process may have limitations in scalability to larger industrial scales, such as uniformity issues on 200 mm wafers, and potential stability concerns with chemical solutions. Optimization is needed for different polymeric materials and complex MEMS structures.
1：Experimental Design and Method Selection:
The study employs a one-step diazonium-induced anchoring process for covalent grafting of aminophenyl layers onto KMPR polymer, followed by activation with palladium chloride and electroless nickel plating. This design aims to avoid chromic acid and reduce noble metal usage, focusing on aqueous and environmentally friendly methods.
2：Sample Selection and Data Sources:
KMPR photoresist polymer (MicroChem Corp.) deposited on 200 mm silicon wafers, cut into 5 cm x 6 cm samples. Samples are sonicated in deionized water and isopropanol before use.
3：List of Experimental Equipment and Materials:
Includes KMPR polymer, para-phenylenediamine, hydrochloric acid, sodium nitrite, iron powder (Alfa Aesar), palladium chloride, nickel(II) sulfate hexahydrate, dimethylamine borane (DMAB), citric acid monohydrate, tetra methyl ammonium hydroxide (TMAH), ethylene diamine, sulfuric acid, copper sulfate pentahydrate, thiodiglycolic acid, potassium hydroxide, pure copper plate, deionized water, isopropanol alcohol, nitrogen gas. Equipment: ultrasonic bath (Cole Parmer, 08895–91), XPS apparatus (Axis-165 from Kratos Analytical), SEM (Hitachi S4500 FEG-SEM), AFM (Pico SPM LE from Agilent Technologies/Molecular Imaging), diamond knife for cutting wafers.
4：Experimental Procedures and Operational Workflow:
Substrate preparation by cutting and cleaning; diazonium grafting in acidic solution with iron powder at room temperature for 120 min; activation in PdCl2/HCl solution for 5 min; electroless nickel plating in ultrasonic bath at 65°C for 6 min; electroplating of copper using a two-electrode system at 1.8 mA/cm2 for 15 min; characterization using XPS, SEM, AFM.
5：8 mA/cm2 for 15 min; characterization using XPS, SEM, AFM.
Data Analysis Methods:
5. Data Analysis Methods: XPS data analyzed with Casa XPS software for core level spectra; SEM and AFM for morphological analysis; sheet resistance measured by 4-probe method; adhesion tested per ASTM D3359-09 standard.
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