[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Evaluation of the Thermal Properties for the Design of the Semiconductor Device

摘要： The more semiconductor devices progress, the more importance of caring about heat dissipation from heat generation increase. This is called “Thermal design”. Thermophysical property values like thermal conductivity and thermal expansion coefficient are used as information for thermal design. The specified values in a brochure or literature data of similar materials are usually used as the thermophysical property values for the thermal design. However, when those values are used for simulation, the results may be wrong because an actual measured value such as rate of conduction of heat of an ingredient is different from literature data or the nominal value in many cases. It is thought that there are a lot of cases without considering directionality of an ingredient (anisotropy) and influence of joint interface. We propose that we should measure these values with considering anisotropy, size effect and the bonding state and utilize them for thermal design of electronic materials used in a semiconductor device.