- 标题
- 摘要
- 关键词
- 实验方案
- 产品
-
Investigation of Trap-Induced Threshold Voltage Instability in GaN-on-Si MISHEMTs
摘要： It is shown that an EC–0.90 eV trap in commercial AlGaN/GaN MISHEMTs grown on a Si (111) substrate is responsible for a ?1.8-V threshold voltage (VT) instability using a combination of defect spectroscopy and double-pulsed current–voltage measurements. The EC ? 0.90 eV trap is located in the GaN buffer and is emptied by high drain biases in pinch-off, which raises the trap above the Fermi level in the GaN buffer. This trap also exhibits both fast and slow recovery processes that are explained by the availability of free electrons throughout the depth of the GaN buffer and the trapping process that depletes the free electron concentration. TCAD modeling is used to demonstrate this process and also to show why there is not a significant increase in buffer leakage current after the large negative VT shift due to this trap. This demonstrates that optimizing buffer designs are critical for ideal device performance.
关键词： deep-level transient spectroscopy (DLTS),isothermal,GaN-on-Si,threshold voltage instability,metal-insulator-semiconductor high electron mobility transistors (MISHEMTs),Capture process,trap
更新于2025-09-23 15:22:29
-
A DLTS Perspective on Electrically Active Defects in Plated Crystalline Silicon n <sup>+</sup> p Solar Cells
摘要： Laser ablation (LA) has been compared with standard wet etching for contact opening in crystalline silicon n+p solar cells, from a perspective of electrically active defects, assessed by Deep-Level Transient Spectroscopy (DLTS). Copper metallization is employed, including a plated nickel diffusion barrier. It is shown that a hole trap around 0.17 eV above the valence band is systematically present in the depletion region of the junctions, irrespective of the contact opening method. This level could correspond with the substitutional nickel donor level in silicon and indicates that Ni in-diffusion occurs during the contact processing. No clear evidence for the presence of electrically active copper has been found. In addition, two other hole traps H2 and H3, belonging to point defects, have been observed after wet etching and standard LA, while for the highest laser power (hard LA) a broad band develops around 175 K, which is believed to be associated with dislocations, penetrating the p-type base region. Evidence will also be given for the impurity decoration of the dislocations, which enhances their electrical activity.
关键词： Deep-Level Transient Spectroscopy (DLTS),copper metallization,electrically active defects,laser ablation,nickel diffusion barrier,wet etching,crystalline silicon n+p solar cells
更新于2025-09-11 14:15:04