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[IEEE 2018 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan (2018.11.19-2018.11.21)] 2018 IEEE CPMT Symposium Japan (ICSJ) - Surface analysis of argon and oxygen plasma-treated gold for room temperature wafer scale gold-gold bonding
摘要： The effects of Ar and O2 plasma treatments on Au surface properties were investigated in terms of room-temperature wafer-scale Au-Au bonding. X-ray photoelectron spectroscopy analysis indicated that O2 plasma treatment formed gold oxide (Au2O3) on Au surfaces, and bonded samples treated by O2 plasma showed weak bonding strength (0.14-0.16 J/m2). It seems that Au2O3 impeded Au-Au bonding. On the other hand, strong Au-Au bonding was obtained by using Ar plasma treatment, and bonded samples were fractured at the bulk wafers during the blade test.
关键词： O2 plasma,Room-temperature bonding,Au-Au bonding,Ar plasma
更新于2025-09-23 15:22:29
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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Phase Determination in SLID Bonding
摘要： Solid-liquid interdiffusion (SLID) bonding is a technique based on intermetallic compounds (IMCs), enabling a thermal stability at temperatures far surpassing the bonding temperature. The technique has been developed as a die attach and interconnection technology for high-temperature applications, but is also excellent for fine-pitch bonding, and for obtaining bonds with thin layers of well-defined metallurgy. Determining the phases of IMC in a SLID bond is crucial in order to understand and predict the properties of the bond. The re-melting temperature of the bond is defined by the IMCs present, and thus directly defines the high-temperature range the SLID bond can survive. Furthermore, the phases present in a SLID bond determines whether the bond is at thermal equilibrium, or if reactions to form new IMCs are expected over the lifetime of the SLID bond (at the actual application temperature). Also, material properties such as electrical conductivity and elastic modulus will depend on which phase is present in a SLID bond. The two most common SLID systems are treated in this paper: Cu–Sn has a relatively simple phase diagram, with two IMCs. The possible phases in a Cu–Sn SLID bond are easily identified by Energy-Dispersive X-ray Spectroscopy (EDX) in the Scanning Electron Microscope (SEM), and they are easily differentiated in optical microscopy as well as in SEM microscopy. Routine investigations of spatial distribution of the various phases can thus be performed by microscopy. Au–Sn has a more complex phase diagram. Au and Au–Sn IMCs are easily distinguished in optical microscopy, but not so easily in SEM. The different IMCs are not discernable neither by microscopy nor by EDX. By using Electron Backscatter Diffraction (EBSD) in combination with electron microscopy and EDX, we demonstrate phase identification and the spatial distribution of phases in a complex Au–Sn SLID bond.
关键词： EBSD,TLP bonding,SLID bonding,EDX,microscopy
更新于2025-09-23 15:22:29
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[IEEE 2018 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) - Kyoto, Japan (2018.6.21-2018.6.22)] 2018 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) - Dependence of Characteristics of Directly-Bonded SiC/Si Junctions on Bonding Temperature
摘要： We measure electrical characteristics and die shear strength of directly-bonded n-4H-SiC/p+-Si junction with emphasis on their dependence on the annealing condition during bonding. In the bonding process, we perform lower-temperature annealing at the first step and higher-temperature one at the second step. By increasing annealing temperature at the first step, the impurity concentration obtained by C-V measurement gets close to the impurity concentration of SiC and the bonding strength become larger. These results show that directly-bonded SiC/Si junction characteristics depend on the annealing temperature at the first (lower-temperature) step in the bonding process.
关键词： direct bonding,surface treatment,Si,SiC,annealing
更新于2025-09-23 15:22:29
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Design, synthesis and structural optimization of two click modified butterfly molecules: Aggregation induced ratiometric fluorescence change and ICT associated hydrogen bonding effect in solvatochromic analysis
摘要： Two click modi?ed butter?y molecules are designed and synthesized having presence and absence of the aggregative moiety to differ between aggregation induced ratiometric emission changes via excimer formation and ICT associated hydrogen bonding effect. These two distinct phenomena can be successfully employed in solvatochromic analysis. This is also supported by the theoretical study through the structural variation of the two butter?y molecules.
关键词： Hydrogen bonding,Butter?y molecules,Ratiometric,AIE,Solvatochromic
更新于2025-09-23 15:22:29
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Medium viscosity effect on fluorescent properties of Sn(IV)-tetra(4-sulfonatophenyl)porphyrin complexes in buffer solutions
摘要： Supramolecular triads consisting of hydrophilic Sn(IV)-tetra(4-sulfophenyl)-porphyrin and two axial guests such as propylphenol, tyrosine, and 2-(2-hydroxyphenyl)-benzoxazole were synthesized. The structures of synthesized complexes were identified by experimental spectroscopic and quantum-chemical simulation methods, and their fluorescent properties were studied in various viscosity media (mixed phosphate buffer-glycerin solvents of different composition). The effect of axial ligand structure on the fluorescent properties of these triads (due to the hydrogen bonding or π-π stacking between the components of ?host-guest? systems) is discussed. The potential use of synthesized complexes as environmental probes of local viscosity is proposed.
关键词： synthesis,ROESY,fluorescent properties,hydrogen bonding,DOSY,2D NMR,DFT,viscosity,Sn(IV)-porphyrins
更新于2025-09-23 15:22:29
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Molecular and excited state properties of photostable anthraquinone blue dyes for hydrophobic fibers
摘要： Synthetic dyes having high photostability on hydrophobic fibers such as poly(ethylene terephthalate) (PET) are of interest for use on textile substrates for outdoor applications. While much is known about photostable dyes developed for PET in the 1980s, owing to their viability for use in automobile interiors, little has been published on currently viable photostable disperse dyes. As part of an effort to help fill this void and to facilitate future photostable disperse dye design, the present study involved the use of experimental measurements and modelling studies to help characterize the molecular structures of commercially viable dyes for producing photostable colors on PET fibers, beginning with a pair of blue dyes. With the aid of HR-MS, 500 MHz 1H NMR, and X-ray crystallography, it was established that the two dyes are structural isomers having 1,5-(OH)2-anthraquinone (AQ) and 1,8-(OH)2-AQ base structures. It is proposed that the photostability of these dyes arises from the presence of multiple OH/NH groups ortho to the AQ C]O groups which enables them to dissipate excited state energy through intramolecular proton transfer. Further, using DFT-based molecular modelling studies, it was shown that the dye having the 1,5-(OH)2-AQ base structure has a lower ESOP than the isomeric dye having the 1,8-(OH)2-AQ base structure. Similarly, results from calculating Frontier HOMO and LUMO isosurfaces indicated that the LUMO lobes of the latter dye are larger, suggesting that this dye undergoes excitation faster than the 1,5-(OH)2-AQ isomer.
关键词： Molecular modelling,Anthraquinone disperse dyes,X-ray crystallography,Intramolecular H-bonding,Structural analysis
更新于2025-09-23 15:22:29
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Chemically Interconnected Thermotropic Polymers for Transparency-Tunable and Impact-Resistant Windows
摘要： Thermotropic polymers with the capability of thermally tuning transparency are widely applied in smart windows and energy-saving windows, playing a critical role in enhancing comfort level and energy efficiency of indoor spaces. Usually, thermotropic polymer systems are constructed by physically dispersing phase transition materials in transparent hosting materials. However, bad interfaces universally exist in these systems, resulting in poor mechanical properties, weak interfaces to substrates, or bad long-term stability. Herein, we demonstrate a novel chemically interconnected thermotropic polymer, which is obtained by reacting dodecanedioic acid (DDA) with glycerol. In the system, some of DDA molecules were crosslinked to form a polyester network, poly(glycerol-dodecanoate) (PGD). Other grafted but non-crosslinked DDA molecules form semi-crystalline domains which possess a solid-liquid phase transition within the PGD matrix. The phase transition offers the resulting hybrid materials with tunable optical transparency. The PGD-DDA system shows stable performance after 100 heating-cooling cycles. In addition, when applied for window coating, it results in tough interfacial bonding to glass substrates with toughness of > 6910 J m-2 below its transition temperature and > 135 J m-2 above its transition temperature. It increases the impact-resistance of the window by multiple times.
关键词： chemical interconnection,tough interfacial bonding,impact-resistant,smart windows,thermotropic polymers
更新于2025-09-23 15:22:29
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Effects of triethylamine on the imidization temperature and properties of PI adhesive
摘要： To make clear the effects of triethylamine(TEA) on the imidization temperature and properties of polyimide(PI) adhesive,precursors poly(amic acid) salt(PAAS) synthesized via 4,4-Diaminodiphenylmethane(MDA),2,2-Bis[4-(4-aminophenoxy)phenyl]propane(BAPP),3,3',4,4'-Benzophenonetetracrboxylic dianhydride(BTDA) and TEA in N-Methyl pyrrolidone (NMP) were prepared and used to obtain PI adhesive. The chemical structure of PAAS and PI films were confirmed by 1H NMR and FTIR spectroscopy. It was found that PI-2 adhesive obtained from PAAS-2( the mole ratio of TEA/repeating unite of PAA=2/1) had the best property. TGA showed that the temperature for 5% weight loss of PI-2 could achieve 497 ℃ and tensile test showed PI-2 had superior bonding strength of 14.83 MPa. In addition,the damping performance of PI-2 had a great improvement compared with PI obtained from PAA. Moreover,through the study of imidization temperature,the results suggested that PI adhesive obtained from PAAS could complete the imidization reaction at 280 ℃,which had great significance for saving energy. And PI-300 ℃(the maximum imidization temperature of which was 300 ℃) had superior thermal stability,bonding strength and damping performance simultaneously.
关键词： Imidization temperature,Bonding strength,Polyimide,Poly(amic acid) salt
更新于2025-09-23 15:21:21
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Self-Assembly of a Carboxyl-Functionalized BODIPY Dye via Hydrogen Bonding
摘要： We report the synthesis, characterization, and self-assembly behavior of a 4,4-Difluoro-4-bora-3a,4a-diaza-s-indacene (BODIPY) dye functionalized at the meso-position with a butyric acid group. Various spectroscopic investigations (UV-Vis, emission, and Fourier-transform infrared spectroscopy (FTIR) studies) supported by X-ray analysis revealed the formation of self-assembled structures in the solid state with translationally stacked BODIPY units driven by hydrogen bonding between the carboxyl groups.
关键词： hydrogen bonding,Self-Assembly,weak non-covalent interactions,BODIPY dyes
更新于2025-09-23 15:21:21
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[IEEE 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Zlatibor, Serbia (2018.5.16-2018.5.20)] 2018 41st International Spring Seminar on Electronics Technology (ISSE) - Solid-Liquid Interdiffusion Bonding Based on Au-Sn Intermetallic for High Temperature Applications
摘要： This paper covers one of the aspects of solid-liquid interdiffusion (SLID) bonding of semiconductor structures to substrate for high temperature operation. Investigations were focused on Au/Sn intermetallic compounds formed at the interface between Au metallization on the chip and Sn metallization on the DBC (Direct Bonded Copper) substrate. Two version of SLID were applied: one stage process at 350?°C and two stage process short time at 280?°C + long time at 180?°C. Second process is divided into two steps: short high temperature (280?°C) step for melting Sn and initial intermetallic compound formation and long low temperature (180?°C) step for solid state diffusion process. Design of experiments technique was used for process optimization. The best process parameters were obtained and they were applied for monocrystalline GaN chips assembly to DBC substrates. In the long-term stability tests at 300?°C it was proven that both versions of investigated SLID technique can be applied for monocrystalline GaN chips assembly. Critical condition for this assembly operation is high enough pressure applied on the chip to initiate diffusion process.
关键词： High Temperature Applications,GaN chips,Au-Sn Intermetallic,DBC substrate,Solid-Liquid Interdiffusion Bonding
更新于2025-09-23 15:21:21