The role of interfacial H-bonding in electrical properties of UV-cured resin filled with hydroxylated Al2O3 nanoparticles

摘要： Surface hydroxylation of crude Al2O3 (c-Al2O3) nanoparticles by H2O2 was conducted to tailor the electrical properties of UV-cured resin. The hydroxyl groups on Al2O3 particles were designed to establish hydrogen bonding between hydroxyl and carboxyl with that of UV/c-Al2O3 composites at the same filler content. It was found that the addition of 0.5 wt % h-Al2O3 increases the AC breakdown strength and volume resistivity by 15.5 % and 367.9 %, respectively. Our results suggest that the hydroxylation is an efficient way to improve the electrical properties of UV-cured resin nanocomposites, thus promoting stereolithography 3D printing in application of electrical and electronic field.