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Testing of diffractive optical element as part of specific CO <sub/>2</sub> laser equipment for metallic materials modification
摘要： Testing of a reflective diffractive optical element (DOE) as part of specific CO2 laser equipment Oerlikon OPL 2000 for metallic materials modification was performed. The power density distribution in a plane located behind the DOE focal plane has been measured. It was found that DOEs make it possible to form a predetermined beam power density profile and to perform the transformation of laser energy, chosen by calculation previously. The use of these optical elements in the laser material treatment reveals new possibilities for controlling properties and operational characteristics of processed components. Additional redistribution of the beam power to edges of the laser spot is achieved by increasing the proportion of energy reflected by DOE peripheral zones, for example, by increasing the aperture of the focusable beam. It is proposed using a telescopic system of two lenses to change the aperture of the laser beam focusable by the DOE.
关键词： metallic materials modification,diffractive optical element,beam power density profile,CO2 laser
更新于2025-09-19 17:13:59
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Strategies for Reducing Particle Defects in Ti and TiN Thin-Film Deposition Processes
摘要： Generation of particle defects in semiconductor manufacturing is inevitable, but it has to be minimized to enhance IC yield. There are various causes for the generation of particle defects in different semiconductor manufacturing processes, such as diffusion, thin-film deposition, lithography, etch, and clean. In this work, primary defect generation mechanisms in thin-film deposition processes, such as ALD TiN, RFPVD Ti, and PVD TiN, are discussed. Various strategies, such as periodic clean optimization, on-load clean, idle pasting, periodic pasting optimization, kit life optimization, target burning optimization, and kit hardware selection that reduce the generation of defects in the thin-film deposition processes are presented. This work also discusses hardware-induced surface defect and solutions to reduce them.
关键词： Conductive films,IC manufacturing,Metallic materials,Contamination free manufacturing,Thin films
更新于2025-09-10 09:29:36
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Pilot capability evaluation of a feedback electronic imaging system prototype for in-process monitoring in electron beam additive manufacturing
摘要： Electron beam additive manufacturing (EBAM) is an additive manufacturing (AM) technique increasingly used by many industrial sectors, including medical and aerospace industries. The application of this technology is still, however, challenged by many technical barriers. One of the major issues is the lack of process monitoring and control system to monitor process repeatability and component quality reproducibility. Various techniques, mainly involving infrared (IR) and optical cameras, have been employed in previous attempts to study the quality of the EBAM process. However, all attempts lack the flexibility to zoom-in and focus on multiple regions of the processing area. In this paper, a digital electronic imaging system prototype and a piece of macroscopic process quality analysis software are presented. The prototype aims to provide flexibility in magnifications and the selection of fields of view (FOV). The software aims to monitor the EBAM process on a layer-by-layer basis. Digital electronic images were generated by detecting both secondary electrons (SE) and backscattered electrons (BSE) originating from interactions between the machine electron beam and the processing area using specially designed hardware. Prototype capability experiments, software verification and demonstration were conducted at room temperature on the top layer of an EBAM test build. Digital images of different magnifications and FOVs were generated. The upper range of the magnification achieved in the experiments was 95 and the demonstration verified the potential ability of the software to be applied in process monitoring. It is believed that the prototype and software have significant potential to be used for in-process EBAM monitoring in many manufacturing sectors. This study is thought to be the necessary precursor for future work which will establish whether the concept is suited to working under in-process EBAM operating conditions.
关键词： In-process monitoring,Electron beam melting,Electronic imaging,Metallic materials,Additive manufacturing,Quality control,Backscattered electrons,Secondary electrons
更新于2025-09-10 09:29:36