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[IEEE 2018 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2018.10.23-2018.10.25)] 2018 International Wafer Level Packaging Conference (IWLPC) - Enabling Reliability of 3D TSV Advanced Packages with Nonconductive, Pre-Applied Underfill Film Materials
摘要： Consumer and industry demand for high-performance computing, networking and graphics processing are pushing the limits of semiconductor packaging technology to support high-density integration, greater functionality and more complex device architectures in increasingly smaller form factors. To address these requirements, the packaging advanced is packaging technologies such as 3D stacking of IC chips, vertically connected by through silicon vias (TSVs). Advanced memory manufacturers are already integrating 3D TSV-based chip stacking processes using thermal compression bonding (TCB) the next-generation of memory devices for high bandwidth applications. These dense packaging architectures require materials that enable robust wafer processing and deliver long-term reliability. Moreover, for die thicknesses less than 100 μm, existing non-conductive paste (NCP) materials pose several challenges for thermal compression bonding due to potential die top and bonding tool contamination. Packaging specialists have moved toward the use of non-conductive film (NCF) for die structures – including TSV and Cu pillars – where more controlled flow, precise fillet formation and contamination prevention are essential. In this paper, the latest-generation of NCF materials and corresponding film lamination, base tape removal, die singulation, and thermal compression bonding process will be discussed. The new NCF formulation provides rapid curing kinetics to enable shorter bonding times and, therefore, higher UPH by delivering a three-second bonding profile, as well as feasibility for a two-second bonding profile. Combined with the embedded flux system and flow properties optimization, curing kinetics optimization, the novel NCF material achieves proper solder joint formation, no material entrapment, and void-free filling. Bonding force study of this NCF material was carried out on a die to substrate test vehicle to find out the optimal bonding force. And the reliability testing results will also be discussed. Based on the study outcomes, the new NCF material is expected to show excellent performance for thermal compression bonding for 3D chip-stacking applications.
关键词： UPH,thin die,NCF,3D TSV,chip-stacking
更新于2025-09-23 15:22:29
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[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
摘要： Laser-Assisted Bonding with Compression (LABC) technology with NCF was proposed to accomplish the productivity and process reliability at the same time. A quartz block as a header was used to deliver a pressure to the devices because of its extremely low absorption of the laser during the bonding process. Newly developed NCF for LABC was designed to have stability on a hot stage and to show solder wetting and fast curing with no void and optimal fillet during the LABC bonding process. As the laser is used as a heat source, the uniform heat should be provided on each interconnection without any damages on chip or a substrate. 780μm-thick daisy chain top and bottom chips with the minimum pitch of 30μm and bump number of about 27,000 were successfully bonded using the LABC and NCF film.
关键词： throughput,non-conductive film,laser-assisted bonding,bonding performance,TCB,thermal compression bonding,NCF,LABC,compression
更新于2025-09-23 15:21:01
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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Active Control of NCF Fillet Shape for 3D CoW by Multi Beam Laser Bonder
摘要： Non-conductive film fillet control during the thermal compression bonding using a multi laser beam bonder investigated comparing with the case of using a conventional ceramic pulse heater bonder. The laser bonder can control each laser beam power individually, which can change the temperature distribution in the heated die. Fillet coverage index was defined as the ratio of the fillet width of the die corner and the maximum point of the die peripheral. The optimization of the temperature distribution of the die by the laser bonder could enlarge FCI from 0.25 with even reducing the fillet width at the maximum point of the die peripheral from 167 μm in comparison to those of 0.33 and 187 μm, which were obtained using a conventional bonder with a ceramics pulse heater, respectively.
关键词： laser bonder,fillet shape,High productivity,NCF,multi beam
更新于2025-09-16 10:30:52
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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
摘要： A LABC (Laser-Assisted Bonding with Compression) bonder and NCF (Non-Conductive Film) were developed to increase the productivity of the bonding process for the advanced microelectronic packaging technology. The design features of a LABC make its UPH above 1,000. The NCF was applied to both of LAB and TCB (Thermal Compression Bonding Technology). The 780μm-thick daisy chain top and bottom chips with the minimum pitch of 30μm and bump number of about 27,000 were prepared and tested to verify the LABC and NCF technology. The effects of the laser power on the joints quality after the LABC bonding process were investigated and compared with the joints formed by the TCB technology. Finally, the SAT (Scanning Acoustic Tomography) images of the test vehicles before and after the TCO (Pressurized oven) were observed to check the voids in the NCF after the LABC bonding process.
关键词： thermal compression bonding (TCB),bonding performance,non-conductive film (NCF),throughput,laser-assisted bonding with compression (LABC)
更新于2025-09-16 10:30:52