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AIP Conference Proceedings [AIP Publishing INTERNATIONAL SYMPOSIUM ON GREEN AND SUSTAINABLE TECHNOLOGY (ISGST2019) - Perak, Malaysia (23–26 April 2019)] INTERNATIONAL SYMPOSIUM ON GREEN AND SUSTAINABLE TECHNOLOGY (ISGST2019) - Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
摘要： This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 μm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 μm in routine mass production and values below 20 μm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies.
关键词： metallization,crystalline silicon solar cells,plating technology,multiwire interconnection,shingled cells,interconnection,screen printing
更新于2025-09-12 10:27:22
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Investigation of dielectric layers laser ablation mechanism on n-PERT silicon solar cells for (Ni) plating process: Laser impact on surface morphology, composition, electrical properties and metallization quality
摘要： Laser contact opening is a critical step for solar cells manufacturing and needs to be optimized to achieve high efficiencies. In this paper, laser contact opening using a picosecond laser (wavelength 355 nm, pulse duration 10 ps) has been carried out on n-PERT precursors composed of a SiOx/SiOxNy stack on the rear polished side and a SiOxNy layer on the front textured side. By varying peak fluence from 0.130 J/cm2 to 2.159 J/cm2 and spot overlapping, ninety parameters combinations have been tested to open these dielectric layers. Surface morphology characterization, before and after laser ablation, has been realized using Confocal Laser Scanning Microscopy and Scanning Electron Microscopy. Bulk and surface compositions have also been investigated by Energy Dispersive Spectroscopy and X-ray Photoelectron Spectroscopy analysis, respectively. Results have shown the existence of four separated laser impacted areas on the polished side and a related ablation mechanism is suggested. Also, electrical characterization using four probe measurements and calibrated lifetime photoluminescence revealed that electrical properties of the silicon underlying increased when post laser annealing was performed associated with no spot overlapping. Then, nickel electroless deposition has been performed and first characterizations indicate adherence issues and inhomogeneous metallization. Characterization of metallized samples revealed that these observations were closely linked to the non-homogenous surface morphology and composition after laser ablation.
关键词： Ni plating,Surface damages,n-PERT cell,Ablation mechanism,UV-Picosecond laser
更新于2025-09-12 10:27:22
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AIP Conference Proceedings [AIP Publishing INTERNATIONAL SYMPOSIUM ON GREEN AND SUSTAINABLE TECHNOLOGY (ISGST2019) - Perak, Malaysia (23–26 April 2019)] INTERNATIONAL SYMPOSIUM ON GREEN AND SUSTAINABLE TECHNOLOGY (ISGST2019) - Advances with resist-free copper plating approaches for the metallization of silicon heterojunction solar cells
摘要： The metallization of silicon heterojunction (SHJ) solar cells by selective Cu electroplating without any resist-mask is in development. A thin multi-functional PVD Cu-Al stack is deposited to mask the ITO and to promote homogeneous current distribution for simultaneous bifacial plating. This investigation reviews different approaches to perform the Al-patterning – by printing of a metallic ink, laser metal transfer or selective metal etching – to produce a metal-seed susceptible to plate selectively against the self-passivated Al surface. This NOBLE – native oxide barrier layer for selective electroplated, metallization allows reaching a first promising efficiency of 20.0% on a full area SHJ solar cell with low contact resistivity to ITO. This simultaneous bifacial metallization features several advantages: low temperature processing, high metal conductivity of plated copper, no organic masking and low material costs (almost Ag-free).
关键词： bifacial plating,silicon heterojunction solar cells,resist-free,metallization,PVD Cu-Al stack,Cu electroplating
更新于2025-09-11 14:15:04
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Influence of Cleaning and Soft Etching for Electroless Palladium/Gold Plating on Copper Fine Pattern; 銅配線上への無電解パラジウム/金めっきに及ぼす脱脂処理およびソフトエッチング処理の影響;
摘要： Electroless nickel/gold plating and electroless nickel/palladium/gold plating processing have been applied widely to copper patterns as a surface finishing treatment for electronic devices. Recently, miniaturization of copper patterns has advanced to increase the functionality of electronic devices. Conventional electroless nickel plating processing applied to fine copper patterns causes nickel growth in the lateral direction. As a result, the copper pattern distance narrows, which might cause short circuits. To resolve this difficulty, electroless palladium plating on copper has been investigated. This study specifically examined pretreatment processes involving cleaning and soft etching. Results show that the wire bonding characteristics on the electroless palladium/gold plated film differed remarkably depending on the selection of the pretreatment solution used for cleaning and soft etching. Particularly, using a neutral cleaner and a thiol type soft etching solution suppressed dissolution of the copper during the palladium catalyst treatment. Results show that the possibility of obtaining a palladium plated film with fewer pinholes and voids. For electroless palladium /gold plating processing, results show that the soft etching step and the selection of the pretreatment solution used in the cleaning step are important.
关键词： Cleaning,Soft Etching,Voids,Electroless Palladium Plating Process on Copper
更新于2025-09-10 09:29:36
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Preparation of Conductive Polyester Fibers Using Continuous Two-Step Plating Silver
摘要： Polyester ?bers are used in various ?elds, due to their excellent mechanical and chemical stability. However, the lack of conductivity limits their application potential. In order to prepare conductive polyester ?bers, silver is one of the most widely used materials to coat the surface of the ?bers. This work aimed to prepare silver-coated polyester ?bers by a continuous two-step method, which combined the operations of continuous electroless plating and electroplating. Meanwhile, we designed specialized equipment for the continuous plating of silver on the polyester ?bers under a dynamic condition. The mechanical property, washability, electrical resistivity, and electrical conductivity of the resultant conductive polyester ?bers obtained from different silver-plating conditions were also characterized. The results demonstrated that the conductive ?bers prepared by continuous two-step silver plating equipment, had good electrical conductivity with better mechanical properties and washability.
关键词： electroplating,polyester ?ber,continuous two-step silver plating,electroless plating,dynamic condition
更新于2025-09-09 09:28:46
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[IEEE 2018 IEEE International Interconnect Technology Conference (IITC) - Santa Clara, CA, USA (2018.6.4-2018.6.7)] 2018 IEEE International Interconnect Technology Conference (IITC) - Modulation of Within-Wafer and Within-die Topography for Damascene Copper in Advanced Technology
摘要： A novel copper electroplating and CMP process was developed to effectively modulate the within-wafer and within-die nanoscale topography. The feasibility of this new metallization is demonstrated on a 64nm pitch product with an equivalent defect in resistance and trench height. It’s believed to be extendable to other advanced nodes for a sizable reduction in copper overburden which saves CMP polish cycle time from the plan-of-record time. lower and tighter distribution level, uniformity improvement as well as substantial overburden thickness reduction as will be described in this paper.
关键词： within-die non-uniformity,topography,Cu CMP,Copper damascene plating
更新于2025-09-09 09:28:46
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Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
摘要： The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between ?50 and 250 ?C. AMB substrates with Al2O3 and AlN fractured only after 10 cycles, but with Si3N4 ceramic, they retained good thermal stability even beyond 1000 cycles, regardless of the metallization type. The Ni layer on the surviving AMB substrates with Si3N4 was not damaged, while a crack occurred in the Ni–P layer. For DBA substrates, fracture did not occur up to 1000 cycles for all kind of ceramics. On the other hand, the Ni–P layer was roughened and cracked according to the severe deformation of the aluminum layer, while the Ni layer was not damaged after thermal shock tests. In addition, the deformation mechanism of an Al plate on a ceramic substrate was investigated both by microstructural observation and ?nite element method (FEM) simulation, which con?rmed that grain boundary sliding was a key factor in the severe deformation of the Al layer that resulted in the cracking of the Ni–P layer. The fracture suppression in the Ni layer on DBA/AMB substrates can be attributed to its ductility and higher strength compared with those of Ni–P plating.
关键词： DBA,cracking,Ni–P electroless plating,Ni electroplating,reliability,grain boundary sliding,AMB,thermal shock test,roughness,metallization
更新于2025-09-09 09:28:46
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Toxicity effects of nickel electroplating effluents treated by photoelectrooxidation in the industries of the Sinos River Basin
摘要： The Sinos river Basin is an industrial region with many tanneries and electroplating plants in southern Brazil. The wastewater generated by electroplating contains high loads of salts and metals that have to be treated before discharge. After conventional treatment, this study applied an advanced oxidative process to degrade organic additives in the electroplating bright nickel baths effluent. Synthetic rinsing water was submitted to physical-chemical coagulation for nickel removal. The sample was submitted to ecotoxicity tests, and the effluent was treated by photoelectrooxidation (PEO). The effects of current density and treatment time were evaluated. The concentration of total organic carbon (TOC) was 38% lower. The toxicity tests of the effluent treated using PEO revealed that the organic additives were partially degraded and the concentration that is toxic for test organisms was reduced.
关键词： toxicity,nickel plating effluent,photoelectrooxidation,organic additives
更新于2025-09-04 15:30:14