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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - A novel organic coating assisted laser drilling method for TSV fabrication
摘要： Through-silicon vias (TSVs) is a promising three-dimensional packaging solution in post-Moore's law era in the semiconductor industry. The fabrication of through silicon via plays an important role in three-dimensional packaging. Laser drilling is widely used in TSVs fabrication. However, the geometry quality of laser drilling is unsatisfied and heat affected zone (HAZ) is intrinsic. In this work, a novel organic coating assisted picosecond UV laser drilling method is proposed to obtain high-quality TSVs, the HAZ was noticeably eliminated and the TSVs quality was significantly improved. The effects of the organic thickness and laser power on the TSVs' quality were also studied in detail. It is found that the diameter of vias decreases with the increase of the organic thickness and decrease of the laser power. The minimum diameter of TSV obtained by this method is about 15 μm while the aspect ratio is beyond 30. Most importantly, by coating with the organic layer, the minimized via diameter can be decreased to about only 70% of the laser spot size which breaks the limit that the minimized via should be larger than or at least equal to the laser spot size. These findings will be helpful for TSV technology development in modern three-dimensional packaging.
关键词： ultraviolet picosecond laser drilling,through silicon via,heat affected zone elimination,organics coating method
更新于2025-09-23 15:22:29
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An experimental investigation of laser drilling nitrile butadine (NBR) rubber
摘要： This paper focusses on understanding laser-NBR rubber interactions in particular the effect of laser wavelength and pulse width on material removal and thermal damage. Three lasers with wavelengths at 355 nm, 795 nm and 1064 nm and pulse duration at 30 ns, 10 ps and 130 fs, respectively, have been investigated for their optical absorption, heat conduction and their material removal mechanisms in high aspect ratio drilling of NBR rubber. It is interesting to find that under certain conditions, the ultrashort pulse lasers (both the femtosecond and picosecond lasers) did not lead to better results than the nanosecond UV laser in drilling hole profile (straightness and thermal damage), aspect ratio and amount of the ablated material re-deposition on the substrate surfaces. The results implied that there is heat conduction and thermal damage even with ultrashort laser pulses when the processing conditions are not appropriate. Firing laser pulses intermittently was shown to reduce thermal accumulation. Experimental studies showed that the 355-nm Nd:YAG laser (UV laser) achieved higher material removal rate with high aspect ratio as compared to the ultrashort laser pulses in drilling the NBR substrates.
关键词： NBR rubber,Pulse width effect,Picosecond laser drilling,UV laser drilling,Femtosecond laser drilling
更新于2025-09-16 10:30:52