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- 摘要
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- 实验方案
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[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
摘要： Laser-Assisted Bonding with Compression (LABC) technology with NCF was proposed to accomplish the productivity and process reliability at the same time. A quartz block as a header was used to deliver a pressure to the devices because of its extremely low absorption of the laser during the bonding process. Newly developed NCF for LABC was designed to have stability on a hot stage and to show solder wetting and fast curing with no void and optimal fillet during the LABC bonding process. As the laser is used as a heat source, the uniform heat should be provided on each interconnection without any damages on chip or a substrate. 780μm-thick daisy chain top and bottom chips with the minimum pitch of 30μm and bump number of about 27,000 were successfully bonded using the LABC and NCF film.
关键词： throughput,non-conductive film,laser-assisted bonding,bonding performance,TCB,thermal compression bonding,NCF,LABC,compression
更新于2025-09-23 15:21:01
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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Vertical Laser Assisted Bonding for Advanced "3.5D" Chip Packaging
摘要： In this work the processes of laser assisted bonding (LAB) is compared to thermal compression bonding (TCB). Their respective advantages and disadvantages regarding the assembly of flip chip stacks are compared. It is found, that the LAB allows for faster processing, negligible compression force and creates less internal stress in the chip stack. The concept of “3.5D” stacking is introduced. This new concept allows for the vertical bonding of chips/semiconductors to the sides of a chip stack. The vertically bonded parts can be used to contact the layers, which eliminates the individual necessity for through silicon vias (TSVs).
关键词： 3D-packaging,Silicon interposer,Thermal compression bonding (TCB),Inter metallic phase (IMC-layer),Laser assisted bonding (LAB),System on Package (SOP),Laser beam modulation,vertical Flip Chip bonding
更新于2025-09-16 10:30:52
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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
摘要： A LABC (Laser-Assisted Bonding with Compression) bonder and NCF (Non-Conductive Film) were developed to increase the productivity of the bonding process for the advanced microelectronic packaging technology. The design features of a LABC make its UPH above 1,000. The NCF was applied to both of LAB and TCB (Thermal Compression Bonding Technology). The 780μm-thick daisy chain top and bottom chips with the minimum pitch of 30μm and bump number of about 27,000 were prepared and tested to verify the LABC and NCF technology. The effects of the laser power on the joints quality after the LABC bonding process were investigated and compared with the joints formed by the TCB technology. Finally, the SAT (Scanning Acoustic Tomography) images of the test vehicles before and after the TCO (Pressurized oven) were observed to check the voids in the NCF after the LABC bonding process.
关键词： thermal compression bonding (TCB),bonding performance,non-conductive film (NCF),throughput,laser-assisted bonding with compression (LABC)
更新于2025-09-16 10:30:52
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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Multi dies simultaneous bonding for power device with the newly developed pressure leveling film
摘要： The performance of the newly developed film to level the applied pressure among dies in the process of multi dies simultaneous bonding was evaluated. Sintering Ag paste was used as pre-applied connection material. The leveling performance was evaluated by nine dies simultaneous bonding. The height of the dies was intentionally differed one another, which was controlled by a SUS tape insertion between the bonding tool and the dies. The film compensated the height difference of up to 50 μm in the bonding process. The results of the cross sectional observation after the bonding showed that the dense sintered Ag layer was formed uniformly in all dies in spite of with and without the SUS tape insertion on the backsides of the dies.
关键词： bonding,force leveling film (BFL),sintering Ag paste,high productivity,simultaneous bonding,thermal compression bonding (TCB)
更新于2025-09-09 09:28:46